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Journal Articles

A Highly Efficient Integrated Silicon-Microchannel Cooler for Multi-Module Electronic Microsystems: Model Design, Optimization, and Performance Validation

Jiejun Wang, Tao Wang, Qiuyan Li, Yiming Li, Chuangui Wu, Wanli Zhang
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. October 2021, 13(5): 051016.
Paper No: TSEA-20-1273
https://doi.org/10.1115/1.4049433
Published Online: March 10, 2021
... the fluidic and thermal behaviors. For multi-module cooling, reasoned structural design and optimizations improve coolant flow uniformity in microchannels and reducing pressure drop. Then, for high heat flux removal, we enhance the cooling performance through some methods, which include higher surface...
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Topics: Cooling, Microchannels, Coolants, Microelectromechanical systems, Temperature, Heat, Flow (Dynamics), Fluids, Silicon, Heat transfer