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J. Thermal Sci. Eng. Appl. November 2023, 15(11): 111001. doi: https://doi.org/10.1115/1.4062921
J. Thermal Sci. Eng. Appl. November 2023, 15(11): 111002. doi: https://doi.org/10.1115/1.4062954
J. Thermal Sci. Eng. Appl. November 2023, 15(11): 111003. doi: https://doi.org/10.1115/1.4062975
J. Thermal Sci. Eng. Appl. November 2023, 15(11): 111004. doi: https://doi.org/10.1115/1.4062955
J. Thermal Sci. Eng. Appl. November 2023, 15(11): 111005. doi: https://doi.org/10.1115/1.4062998
J. Thermal Sci. Eng. Appl. November 2023, 15(11): 111006. doi: https://doi.org/10.1115/1.4062999
J. Thermal Sci. Eng. Appl. November 2023, 15(11): 111007. doi: https://doi.org/10.1115/1.4063043
J. Thermal Sci. Eng. Appl. November 2023, 15(11): 111008. doi: https://doi.org/10.1115/1.4063044
J. Thermal Sci. Eng. Appl. November 2023, 15(11): 111009. doi: https://doi.org/10.1115/1.4063046
J. Thermal Sci. Eng. Appl. November 2023, 15(11): 111010. doi: https://doi.org/10.1115/1.4063045
J. Thermal Sci. Eng. Appl. November 2023, 15(11): 111011. doi: https://doi.org/10.1115/1.4063097
J. Thermal Sci. Eng. Appl. November 2023, 15(11): 111012. doi: https://doi.org/10.1115/1.4063098
J. Thermal Sci. Eng. Appl. November 2023, 15(11): 111013. doi: https://doi.org/10.1115/1.4063164
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