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Y. Polsky
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Journal Articles

Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation

Y. Polsky, I. C. Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 263–270.
https://doi.org/10.1115/1.2793850
Published Online: December 1, 1999
View Article titled, Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation
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Topics: Circuits, Modeling, Printed circuit boards, Reflow soldering, Thermoelasticity, Warping, Copper, Elasticity, Lamination, Micromechanics (Engineering)
Journal Articles

Derivation of the Casimir Limit Phonon Distribution Using the Boltzmann Transport Equation

Y. Polsky, Y. Bayazitoglu
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. August 1995, 117(3): 751–755.
https://doi.org/10.1115/1.2822640
Published Online: August 1, 1995
View Article titled, Derivation of the Casimir Limit Phonon Distribution Using the Boltzmann Transport Equation
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Topics: Heat conduction, Phonons