1-6 of 6
Shuodao Wang
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Mechanics of Regular-Shape Nanomeshes for Transparent and Stretchable Devices

Sandra Vinnikova, Hui Fang, Shuodao Wang
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. October 2020, 87(10): 101010.
Paper No: JAM-20-1359
https://doi.org/10.1115/1.4047777
Published Online: July 27, 2020
View Article titled, Mechanics of Regular-Shape Nanomeshes for Transparent and Stretchable Devices
Open the PDF for Mechanics of Regular-Shape Nanomeshes for Transparent and Stretchable Devices in another window
Topics: Mechanical properties, Shapes, Stiffness, Transparency, Finite element analysis, Deformation, Design
Journal Articles

Mechanics of Periodic Film Cracking in Bilayer Structures Under Stretching

Xianhong Meng, Zihao Wang, Sandra Vinnikova, Shuodao Wang
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. July 2018, 85(7): 071006.
Paper No: JAM-18-1115
https://doi.org/10.1115/1.4039757
Published Online: May 8, 2018
View Article titled, Mechanics of Periodic Film Cracking in Bilayer Structures Under Stretching
Open the PDF for Mechanics of Periodic Film Cracking in Bilayer Structures Under Stretching in another window
Topics: Cracking (Materials), Fracture (Materials), Fracture (Process), Stress, Flexible electronics, Stress concentration, Finite element analysis, Displacement, Biological tissues
Includes: Supplementary data
Journal Articles

An Improved Fourier–Ritz Method for Analyzing In-Plane Free Vibration of Sectorial Plates

Siyuan Bao, Shuodao Wang, Bo Wang
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. September 2017, 84(9): 091001.
Paper No: JAM-17-1136
https://doi.org/10.1115/1.4037030
Published Online: July 7, 2017
View Article titled, An Improved Fourier–Ritz Method for Analyzing In-Plane Free Vibration of Sectorial Plates
Open the PDF for An Improved Fourier–Ritz Method for Analyzing In-Plane Free Vibration of Sectorial Plates in another window
Topics: Boundary-value problems, Plates (structures), Springs, Stiffness, Vibration, Displacement, Free vibrations, Fourier series
Journal Articles

Wrinkling of Tympanic Membrane Under Unbalanced Pressure

Bo Wang, Pravarsha Ghanta, Sandra Vinnikova, Siyuan Bao, Junfeng Liang, Hongbing Lu, Shuodao Wang
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. April 2017, 84(4): 041002.
Paper No: JAM-16-1622
https://doi.org/10.1115/1.4035858
Published Online: February 8, 2017
View Article titled, Wrinkling of Tympanic Membrane Under Unbalanced Pressure
Open the PDF for Wrinkling of Tympanic Membrane Under Unbalanced Pressure in another window
Topics: Finite element analysis, Membranes, Pressure, Shells, Ear, Deformation
Journal Articles

Mechanics of Interfacial Delamination in Epidermal Electronics Systems

Huanyu Cheng, Shuodao Wang
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Briefs
J. Appl. Mech. April 2014, 81(4): 044501.
Paper No: JAM-13-1330
https://doi.org/10.1115/1.4025305
Published Online: October 16, 2013
View Article titled, Mechanics of Interfacial Delamination in Epidermal Electronics Systems
Open the PDF for Mechanics of Interfacial Delamination in Epidermal Electronics Systems in another window
Topics: Delamination, Electronics, Skin, Surface roughness
Journal Articles

Mechanics of Epidermal Electronics

Shuodao Wang, Ming Li, Jian Wu, Dae-Hyeong Kim, Nanshu Lu, Yewang Su, Zhan Kang, Yonggang Huang, John A. Rogers
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. May 2012, 79(3): 031022.
https://doi.org/10.1115/1.4005963
Published Online: April 5, 2012
View Article titled, Mechanics of Epidermal Electronics
Open the PDF for Mechanics of Epidermal Electronics in another window
Topics: Electronics, Skin, Surface roughness, Silicones, Adhesion, Finite element analysis