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S. K. Sitaraman
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Journal Articles

Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics

R. I. Okereke, S. K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031006.
Paper No: EP-14-1030
https://doi.org/10.1115/1.4030065
Published Online: September 1, 2015
View Article titled, Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics
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Topics: Dimensions, Electrical resistance, Fatigue life, Manufacturing, Solders, Stress, Warping, Cycles, Signals, Thermomechanics
Journal Articles

Determination of Fracture Toughness for Metal/Polymer Interfaces

V. Sundararaman, S. K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 275–281.
https://doi.org/10.1115/1.2793852
Published Online: December 1, 1999
View Article titled, Determination of Fracture Toughness for Metal/Polymer Interfaces
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Topics: Fracture toughness, Metals, Polymers, Finite element analysis, Fracture (Materials), Electronic packaging
Journal Articles

New Reworkable High Temperature Low Modulus (in Excess of 400–500 °C) Adhesives for MCM-D Assembly

Jiali Wu, Randy T. Pike, S. K. Sitaraman, C. P. Wong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 55–60.
https://doi.org/10.1115/1.483124
Published Online: August 31, 1999
View Article titled, New Reworkable High Temperature Low Modulus (in Excess of 400–500 °C) Adhesives for MCM-D Assembly
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Topics: Adhesives, Tiles, Thermal stability, High temperature, Glass, Manufacturing, Pallets, Adhesion
Journal Articles

Warpage and Interfacial Stress Distribution in a Single-Level Integrated Module (SLIM)

R. C. Dunne, S. K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 197–203.
https://doi.org/10.1115/1.2792234
Published Online: September 1, 1997
View Article titled, Warpage and Interfacial Stress Distribution in a Single-Level Integrated Module (SLIM)
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Topics: Stress concentration, Warping, Thermomechanics, Delamination, Design, Dielectric materials, Electronic components, Failure, Shear (Mechanics), Stress