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Proceedings Papers

Liquid Flow Analysis in Porous Media for Large Vapor Chamber With Multiple Heat Sources

Sergio Escobar, Niru Kumari, Rocky Shih, Sarah Anthony, Cullen Bash
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A060, July 6–9, 2015
Paper No: IPACK2015-48770
https://doi.org/10.1115/IPACK2015-48770
View Paper titled, Liquid Flow Analysis in Porous Media for Large Vapor Chamber With Multiple Heat Sources
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Topics: Flow (Dynamics), Heat, Porous materials, Vapors, Cooling, Heat transfer, Approximation, Capillarity, Computational fluid dynamics, Design
Journal Articles

From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Niru Kumari, Tahir Cader
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041009.
https://doi.org/10.1115/1.4007744
Published Online: November 26, 2012
View Article titled, From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency
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Topics: Cooling, Data centers, Heat sinks, Leakage, Temperature, Energy consumption, Heat
Journal Articles

From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Brandon Rubenstein, Scot Heath, Niru Kumari
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041006.
https://doi.org/10.1115/1.4007110
Published Online: October 30, 2012
View Article titled, From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency
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Topics: Containment, Data centers, Heat, Heat sinks, Temperature, Air flow
Proceedings Papers

On the Need for Energy Efficiency Metrics That Span Integrated IT-Facility Infrastructures

Amip J. Shah, Cullen E. Bash, Niru Kumari, Tahir Cader, Thomas J. Breen, Ed J. Walsh, Jeff Punch
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 541-551, July 6–8, 2011
Paper No: IPACK2011-52140
https://doi.org/10.1115/IPACK2011-52140
View Paper titled, On the Need for Energy Efficiency Metrics That Span Integrated IT-Facility Infrastructures
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Topics: Energy efficiency, Data centers, Energy consumption, Traction
Proceedings Papers

Influence of Experimental Uncertainty on Prediction of Holistic Multi-Scale Data Center Energy Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Niru Kumari, Cullen E. Bash, Scot Heath, Brandon Rubenstein
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 553-563, July 6–8, 2011
Paper No: IPACK2011-52141
https://doi.org/10.1115/IPACK2011-52141
View Paper titled, Influence of Experimental Uncertainty on Prediction of Holistic Multi-Scale Data Center Energy Efficiency
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Topics: Data centers, Energy efficiency, Uncertainty, Stress, Temperature, Design, Experimental analysis, Flow (Dynamics), Air flow, Compressors
Proceedings Papers

From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and its Impact on Cooling Infrastructure Energy Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Niru Kumari, Tahir Cader
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 433-442, July 6–8, 2011
Paper No: IPACK2011-52030
https://doi.org/10.1115/IPACK2011-52030
View Paper titled, From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and its Impact on Cooling Infrastructure Energy Efficiency
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Topics: Cooling, Cooling towers, Data centers, Energy efficiency, Leakage, Modeling, Operating temperature, Energy consumption, Heat, Accounting
Proceedings Papers

A Data Center Environmental Advisory System

Christopher Hoover, Niru Kumari, Carlos Felix, Cullen Bash
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 511-517, July 6–8, 2011
Paper No: IPACK2011-52128
https://doi.org/10.1115/IPACK2011-52128
View Paper titled, A Data Center Environmental Advisory System
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Topics: Data centers, Cooling, Air conditioners, Computers, Geometry, Stress, Temperature, Tiles, Vents
Proceedings Papers

Optimization of Outside Air Cooling in Data Centers

Niru Kumari, Rocky Shih, Alan McReynolds, Ratnesh Sharma, Tom Christian, Cullen Bash
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 519-525, July 6–8, 2011
Paper No: IPACK2011-52132
https://doi.org/10.1115/IPACK2011-52132
View Paper titled, Optimization of Outside Air Cooling in Data Centers
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Topics: Cooling, Data centers, Optimization, Temperature, Flow (Dynamics)
Proceedings Papers

Single-Step Fabrication and Characterization of Ultrahydrophobic Surfaces With Hierarchical Roughness

Susmita Dash, Niru Kumari, Mercy Dicuangco, Suresh V. Garimella
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 685-692, July 6–8, 2011
Paper No: IPACK2011-52046
https://doi.org/10.1115/IPACK2011-52046
View Paper titled, Single-Step Fabrication and Characterization of Ultrahydrophobic Surfaces With Hierarchical Roughness
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Topics: Manufacturing, Surface roughness, Drops, Microscale devices, Dynamics (Mechanics), Etching, Robustness, Wetting
Proceedings Papers

From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Brandon Rubenstein, Scot Heath, Niru Kumari
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T10074, March 13–17, 2011
Paper No: AJTEC2011-44091
https://doi.org/10.1115/AJTEC2011-44091
View Paper titled, From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency
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Topics: Containment, Cooling towers, Data centers, Modeling, Energy efficiency, Cooling systems, Air flow, Computers, Temperature, Cooling
Proceedings Papers

Numerical Analysis of Mist-Cooled High Power Components in Cabinets

Niru Kumari, Vaibhav Bahadur, Marc Hodes, Todd Salamon, Alan Lyons, Paul Kolodner, Suresh V. Garimella
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 933-944, July 19–23, 2009
Paper No: InterPACK2009-89269
https://doi.org/10.1115/InterPACK2009-89269
View Paper titled, Numerical Analysis of Mist-Cooled High Power Components in Cabinets
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Topics: Numerical analysis, Flow (Dynamics), Heat sinks, Drops, Evaporation, Telecommunications, Thermal management, Acoustics, Circuits, Cooling
Proceedings Papers

Analysis and Performance Comparison of Competing Desktop Cooling Technologies

Niru Kumari, Shankar Krishnan, Suresh V. Garimella
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 1019-1027, July 8–12, 2007
Paper No: IPACK2007-33407
https://doi.org/10.1115/IPACK2007-33407
View Paper titled, Analysis and Performance Comparison of Competing Desktop Cooling Technologies
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Topics: Cooling, Energy dissipation, Heat, Heat sinks, Impingement cooling, Junctions, Metal foams, Microchannels, Pumps, Semiconductors (Materials)