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Journal Articles

Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Jin Cui, Liang Pan, Justin A. Weibel
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031114.
Paper No: EP-19-1110
DOI: https://doi.org/10.1115/1.4047356
Published Online: June 8, 2020
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Topics: Heat sinks, Polymers, Surface roughness, Pressure, Thermal conductivity, Thermal resistance
Proceedings Papers

Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Jin Cui, Liang Pan, Justin A. Weibel
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 7–9, 2019
Paper No: IPACK2019-6389
DOI: https://doi.org/10.1115/IPACK2019-6389
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Topics: Compression, Contact resistance, Cycles, Fibers, Heat sinks, Microscale devices, Polymers, Pressure, Springs, Surface roughness
Journal Articles

Effect of Electromagnetic Force on Dynamic Mechanical Properties of the Magnetorheological Elastomer Under Compression Mode

Xinxin Shi, Shaogang Liu, Dan Zhao, Zhenghang Zhao, Jin Cui, Feihao Wang
Journal: Journal of Engineering Materials and Technology
Article Type: Research Papers
J. Eng. Mater. Technol. April 2020, 142(2): 021004.
Paper No: MATS-19-1177
DOI: https://doi.org/10.1115/1.4045328
Published Online: November 19, 2019
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Topics: Compression, Electromagnetic force, Mechanical properties, Testing, Elastomers, Magnetic fields, Stiffness
Proceedings Papers

Probabilistic Model for Online 3D Printing Service Evaluation

Jin Cui, Lin Zhang, Lei Ren
Proc. ASME. MSEC2017, Volume 3: Manufacturing Equipment and Systems, V003T04A032, June 4–8, 2017
Paper No: MSEC2017-2747
DOI: https://doi.org/10.1115/MSEC2017-2747
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Topics: Additive manufacturing, Evaluation methods, Rapid prototyping
Proceedings Papers

An Optimal Allocation Method for Virtual Resource Considering Variable Metrics of Cloud Manufacturing Service

Jin Cui, Lei Ren, Lin Zhang, Qiong Wu
Proc. ASME. MSEC2015, Volume 2: Materials; Biomanufacturing; Properties, Applications and Systems; Sustainable Manufacturing, V002T04A013, June 8–12, 2015
Paper No: MSEC2015-9245
DOI: https://doi.org/10.1115/MSEC2015-9245
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Topics: Manufacturing, Algorithms, Particle swarm optimization, Optimization, Cloud computing, Virtual assembly
Journal Articles

Cloud-Based Intelligent User Interface for Cloud Manufacturing: Model, Technology, and Application

Lei Ren, Jin Cui, Ni Li, Qiong Wu, Cuixia Ma, Dongxing Teng, Lin Zhang
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research-Article
J. Manuf. Sci. Eng. August 2015, 137(4): 040910.
Paper No: MANU-14-1572
DOI: https://doi.org/10.1115/1.4030332
Published Online: August 1, 2015
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Topics: Manufacturing, User interfaces, Engineering drawings, Engineering prototypes