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Journal Articles

Positioning Error Estimation Models for Horizontal-Distributed Prismatic–Universal–Universal Parallel Mechanism

Jian-Dong Ke, Yu-Jen Wang, Jhy-Cherng Tsai
Journal: Journal of Mechanisms and Robotics
Publisher: ASME
Article Type: Research Papers
J. Mechanisms Robotics. December 2024, 16(12): 121010.
Paper No: JMR-23-1409
https://doi.org/10.1115/1.4065320
Published Online: May 29, 2024
View Article titled, Positioning Error Estimation Models for Horizontal-Distributed Prismatic–Universal–Universal Parallel Mechanism
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Topics: Errors, Kinematics, Artificial neural networks
Proceedings Papers

Development of Step-Based Dimensioning and Tolerancing Data Model

Jhy-Cherng Tsai, Tsan-Chao Chuang, De-Ning Guo
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 699-708, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0841
https://doi.org/10.1115/IMECE1996-0841
View Paper titled, Development of Step-Based Dimensioning and Tolerancing Data Model
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Topics: Geometric dimensioning and tolerancing, Construction, Engineering standards, Information models, Modeling, Tolerance analysis
Proceedings Papers

Experimental Investigation on Chemical-Mechanical Polishing of Wafers With Low-Conductivity Dielectrics

Jhy-Cherng Tsai, Charls Liu, Ming-Hsih Tsai, Bao-Tong Dai
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 135-141, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24717
https://doi.org/10.1115/IMECE2001/EPP-24717
View Paper titled, Experimental Investigation on Chemical-Mechanical Polishing of Wafers With Low-Conductivity Dielectrics
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Topics: Dielectric materials, Electrical conductivity, Polishing, Pressure, Semiconductor wafers, Thermal conductivity
Proceedings Papers

Experimental Investigation of Pressure and Velocity on Chemical Mechanical Planarization

Jhy-Cherng Tsai, Mingyi Tsai
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 221-226, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2267
https://doi.org/10.1115/IMECE2000-2267
View Paper titled, Experimental Investigation of Pressure and Velocity on Chemical Mechanical Planarization
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Topics: Polishing, Pressure, Wear
Proceedings Papers

Neural-Taguchi Method for Robust Design

Gou-Jen Wang, Jhy-Cherng Tsai, Pai-Chung Tzeng, Tsorng-Chi Chen
Proc. ASME. DETC-CIE96, Volume 6: 16th Computers in Engineering Conference, V006T06A050, August 18–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: 96-DETC/CIE-1327
https://doi.org/10.1115/96-DETC/CIE-1327
View Paper titled, Neural-Taguchi Method for Robust Design
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Topics: Artificial neural networks, Design, Engineering design, Feedforward control
Proceedings Papers

Geometric Tolerance Analysis for Mechanism Design

Jhy-Cherng Tsai
Proc. ASME. DETC-CIE96, Volume 3: 22nd Design Automation Conference, V003T03A081, August 18–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: 96-DETC/DAC-1053
https://doi.org/10.1115/96-DETC/DAC-1053
View Paper titled, Geometric Tolerance Analysis for Mechanism Design
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Topics: Design, Tolerance analysis, Errors, Computation, Kinematics, Error analysis, Fittings, Geometric dimensioning and tolerancing, Machine design, Manufacturing
Proceedings Papers

Development of an AutoCAD-Based Geometric Tolerancing System

Jhy-Cherng Tsai, Jing-Sheng Chang
Proc. ASME. DETC97, Volume 2: 23rd Design Automation Conference, V002T29A081, September 14–17, 1997
Publisher: American Society of Mechanical Engineers
Paper No: DETC97/DAC-3998
https://doi.org/10.1115/DETC97/DAC-3998
View Paper titled, Development of an AutoCAD-Based Geometric Tolerancing System
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Topics: Construction, Design, Geometric dimensioning and tolerancing, Manufacturing, Tolerance analysis
Proceedings Papers

Computer-Aided Linear Tolerance Analysis and Optimal Tolerance Distribution for Cylindrical Machined Parts

Jhy-Cherng Tsai, Chin-Ming Shih
Proc. ASME. DETC98, Volume 2: 24th Design Automation Conference, V002T02A013, September 13–16, 1998
Publisher: American Society of Mechanical Engineers
Paper No: DETC98/DAC-5804
https://doi.org/10.1115/DETC98/DAC-5804
View Paper titled, Computer-Aided Linear Tolerance Analysis and Optimal Tolerance Distribution for Cylindrical Machined Parts
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Topics: Computer-aided engineering, Tolerance analysis
Proceedings Papers

A Knowledge Base Approach for Tolerancing in Computer-Aided Process Planning

Jhy-Cherng Tsai, Weirong Tsai
Proc. ASME. DETC99, Volume 1: 25th Design Automation Conference, 905-911, September 12–16, 1999
Publisher: American Society of Mechanical Engineers
Paper No: DETC99/DAC-8632
https://doi.org/10.1115/DETC99/DAC-8632
View Paper titled, A Knowledge Base Approach for Tolerancing in Computer-Aided Process Planning
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Topics: Computer-aided engineering, Databases, Machining, Production planning
Proceedings Papers

Development of Sound Based Tool Wear Monitoring System in Micro-Milling

Ming-Hsing Lee, Ming-Chyuan Lu, Jhy-Cherng Tsai
Proc. ASME. MSEC2010, ASME 2010 International Manufacturing Science and Engineering Conference, Volume 1, 427-434, October 12–15, 2010
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2010-34240
https://doi.org/10.1115/MSEC2010-34240
View Paper titled, Development of Sound Based Tool Wear Monitoring System in Micro-Milling
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Topics: Micromilling, Monitoring systems, Wear, Signals, Condition monitoring, Cutting, Design, Electromagnetic scattering, Feature selection, Microphones
Proceedings Papers

A Statistical Tolerance Analysis Method for Feature in Non-Normal Distribution

Chang-Hsin Kuo, Jhy-Cherng Tsai
Proc. ASME. IDETC-CIE2010, Volume 6: 15th Design for Manufacturing and the Lifecycle Conference; 7th Symposium on International Design and Design Education, 519-524, August 15–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: DETC2010-28658
https://doi.org/10.1115/DETC2010-28658
View Paper titled, A Statistical Tolerance Analysis Method for Feature in Non-Normal Distribution
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Topics: Tolerance analysis, Manufacturing, Design engineering, Gaussian distribution, Simulation, Statistical distributions
Proceedings Papers

Parametric Analysis of Irradiance Distribution in Proximity Printing of Micro Circular and Annulus Apertures

Jhy-Cherng Tsai, Guei-Si Sie, Jhy-Wei Fan
Proc. ASME. IDETC-CIE2010, Volume 4: 12th International Conference on Advanced Vehicle and Tire Technologies; 4th International Conference on Micro- and Nanosystems, 803-809, August 15–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: DETC2010-28648
https://doi.org/10.1115/DETC2010-28648
View Paper titled, Parametric Analysis of Irradiance Distribution in Proximity Printing of Micro Circular and Annulus Apertures
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Topics: Annulus, Printing, Diffraction, Photoresists, Diffraction patterns, Helium-neon lasers, Lithography, Microscale devices, Simulation, Theorems (Mathematics)
Proceedings Papers

Heuristic Machining Process Planning of a Toleranced Handle Based on Graph Inference

Kuo-Ming Cheng, Jhy-Cherng Tsai
Proc. ASME. IDETC-CIE2009, Volume 8: 14th Design for Manufacturing and the Life Cycle Conference; 6th Symposium on International Design and Design Education; 21st International Conference on Design Theory and Methodology, Parts A and B, 379-384, August 30–September 2, 2009
Publisher: American Society of Mechanical Engineers
Paper No: DETC2009-87770
https://doi.org/10.1115/DETC2009-87770
View Paper titled, Heuristic Machining Process Planning of a Toleranced Handle Based on Graph Inference
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Topics: Machining, Production planning, Finishing, Design
Proceedings Papers

Minimum-Gap Evaluation Model for Multi-Constraint in One Dimension

Chang-Hsin Kuo, Jhy-Cherng Tsai
Proc. ASME. IDETC-CIE2008, Volume 5: 13th Design for Manufacturability and the Lifecycle Conference; 5th Symposium on International Design and Design Education; 10th International Conference on Advanced Vehicle and Tire Technologies, 19-24, August 3–6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: DETC2008-50042
https://doi.org/10.1115/DETC2008-50042
View Paper titled, Minimum-Gap Evaluation Model for Multi-Constraint in One Dimension
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Topics: Dimensions, Manufacturing, Fittings, Computational methods, Clearances (Engineering), Statistical distributions, Taguchi methods
Proceedings Papers

An Investigation on the Profile of Microlens by the Thermal Reflow Process Due to Surface Tension and Gravity

Jhy-Cherng Tsai, Yong-Sung Hsu
Proc. ASME. IDETC-CIE2008, Volume 4: 20th International Conference on Design Theory and Methodology; Second International Conference on Micro- and Nanosystems, 569-572, August 3–6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: DETC2008-50077
https://doi.org/10.1115/DETC2008-50077
View Paper titled, An Investigation on the Profile of Microlens by the Thermal Reflow Process Due to Surface Tension and Gravity
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Topics: Gravity (Force), Surface tension, Drops, Photoresists, Melting, Pattern formation, Silicon, Theoretical analysis
Proceedings Papers

Tolerance Induced Performance Variation of a High-Resolution Compliant Micro Stage

Jhy-Cherng Tsai, Mandy Hsiao, Jau-Liang Chen
Proc. ASME. IDETC-CIE2007, Volume 3: 19th International Conference on Design Theory and Methodology; 1st International Conference on Micro- and Nanosystems; and 9th International Conference on Advanced Vehicle Tire Technologies, Parts A and B, 945-948, September 4–7, 2007
Publisher: American Society of Mechanical Engineers
Paper No: DETC2007-35869
https://doi.org/10.1115/DETC2007-35869
View Paper titled, Tolerance Induced Performance Variation of a High-Resolution Compliant Micro Stage
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Topics: Resolution (Optics), Dimensions, Hinges, Springs, Stiffness, Deformation, Displacement, Finite element methods, Machinery, Nanoscale phenomena
Proceedings Papers

Experimental Investigation on Wafer Polishing of Oxide and Copper Layers

Jhy-Cherng Tsai
Proc. ASME. IMECE2002, Microelectromechanical Systems, 321-326, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-33463
https://doi.org/10.1115/IMECE2002-33463
View Paper titled, Experimental Investigation on Wafer Polishing of Oxide and Copper Layers
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Topics: Copper, Polishing, Semiconductor wafers
Proceedings Papers

Experimental Investigation on the Roles of Chemical Corrosion and Mechanical Polishing on Copper CMP

Jhy-Cherng Tsai, Yaw-Yi Shieh, Ming-Shih Tsai, Bau-Tong Dai
Proc. ASME. IMECE2004, Manufacturing Engineering and Materials Handling Engineering, 537-540, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-61072
https://doi.org/10.1115/IMECE2004-61072
View Paper titled, Experimental Investigation on the Roles of Chemical Corrosion and Mechanical Polishing on Copper CMP
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Topics: Copper, Corrosion, Polishing