1-1 of 1
Keywords: wafer bonding alignment system
Sort by
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Micro Nano-Manuf. June 2023, 11(2): 024503.
Paper No: JMNM-23-1057
Published Online: May 8, 2024
... errors and thermal deformation errors. The error budget predicts the overall performance of the system by synthesizing the final impact of these error sources on the position of the end effector of the system. Error budgeting for wafer bonding alignment systems is an important means to ensure alignment...