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Keywords: integrated circuit technology
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Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Manuf. Sci. Eng. August 2005, 127(3): 564–571.
Published Online: September 18, 2004
... is found to suppress the recirculation and shorten the cooling time. However, a fast convective cooling rate would result in a significant temperature difference between center and edge of the wafer, thus causing material failure due to an increase of thermal stresses. integrated circuit technology...
