This paper reports on the development of a machining device which is capable of carrying out precision machining experiments under external hydrostatic pressure. Machining trials were conducted on hard-brittle materials such as soda glass, quartz glass, silicon and quartz wafers using the newly developed machining device under the externally applied hydrostatic pressures of zero and 400 MPa. The machined traces were analyzed by laser microscope. From the trace profiles, crack ratio and area of cross section of the trace were estimated. The applied hydrostatic pressure enhanced the critical cross sectional area and reduced the cracks and chippings of all the tested materials. Effects of hydrostatic pressure on the machining characteristics of the crystalline and glassy materials are discussed in detail. The mechanism behind the enhancement of ductile-brittle transition by the externally applied hydrostatic pressure is also elucidated by a theoretical model.
Issue Section:
Technical Papers
1.
Yoshikawa
, H.
, 1969, “Brittle-Ductile Behavior of Crystal Surface in Finishing
,” Journal of Japan Society of Mechanical Engineers
, 35
(10
), pp. 662
–667
.2.
Puttick
, K. E.
, Rudman
, M. R.
, Smith
, K. J.
, Franks
, A.
, and Lindsey
, K.
, 1989, “Single-point Diamond Machining of Glasses
,” Proc. R. Soc. London, Ser. A
1364-5021, 426
, pp. 19
–30
.3.
Nakatsuji
, T.
, Kodera
, S.
, Hara
, S.
, Matsunaga
, H.
, Ikawa
, N.
, and Shimada
, S.
, 1990, “Diamond Turning of Brittle Materials for Optical Components
,” CIRP Ann.
0007-8506, 39
(1
), pp. 89
–92
.4.
Blake
, P. N.
, and Scattergood
, R. O.
, 1990, “Ductile-Regime Machining of Germanium and Silicon
,” J. Am. Ceram. Soc.
0002-7820, 73
(4
), pp. 949
–957
.5.
Ichida
, Y.
, Kishi
, K.
, Hasuta
, Y.
, and Akbari
, J.
, 1991 “Study on Mirror Finish Grinding of Fine Ceramics (1st report)
,” Int. J. Jpn. Soc. Precis. Eng.
0916-782X, 57
(8
), pp. 1406
–1412
.6.
Bifano
, T. G.
, Dow
, T. A.
, and Scattergood
, R. O.
, 1991, “Ductile-Regime Grinding: A New Technology for Machining Brittle Materials,” Transactions of the ASME, Ser. B
, J. Eng. Ind.
0022-0817, 113
, pp. 184
–189
.7.
Wu
, T.
, Morita
, N.
, and Yoshida
, K.
, 1993, “Study on the Diamond Cutting of Silicon Single Crystal (1st report)
,” Journal of Japan Society of Mechanical Engineering
, C59
(577
), pp. 283
–288
.8.
Yoshino
, M.
, and Shirakashi
, T.
, 1993, “Ductile Mode Cutting of Glass
,” Proceedings of ICMT’93
, pp. 1
–6
.9.
Shibata
, T.
, Ono
, A.
, Kurihara
, K.
, Makino
, E.
, and Ikeda
, M.
, 1994, “Cross-section Transmission Electron Microscope Observations of Diamond-turned Single Crystal Si Surfaces
,” Appl. Phys. Lett.
0003-6951, 65
(20
), pp. 2553
–2555
.10.
Yoshino
, M.
, Aoki
, T.
, Shirakashi
, T.
, and Komanduri
, R.
, 2001, “Some Experiments on the Scratching of Silicon in-situ Scratching Inside an SEM and Scratching under High External Hydrostatic Pressures
,” J. Mech. Eng. Sci.
0022-2542, 43
, pp. 335
–347
.11.
Yoshino
, M.
, Aoki
, T.
, Chandrasekaran
, N.
, Shirakashi
, T.
, and Komanduri
, R.
, 2001, “Finite Element Simulation of Plane Strain Plastic-Elastic Indentation on Single Crystal Silicon
,” J. Mech. Eng. Sci.
0022-2542, 43
, pp. 313
–333
.12.
Yan
, J.
, Yoshino
, M.
, Kuriagawa
, T.
, Shirakashi
, T.
, Syoji
, K.
, and Komanduri
, R.
, 2001, “On the Ductile Machining of Silicon for Micro Electro-mechanical (MEMS), Opto-electronic and Optical Applications
,” Mater. Sci. Eng., A
0921-5093 297
, pp. 230
–234
.13.
Morris
, J. C.
, Callahan
, D. L.
, Kulik
, J.
, Patten
, J. A.
, and Scattergood
, R. O.
, 1995, “Origins of the Ductile Regime in Single-Point Diamond Turning of Semiconductors
,” J. Am. Ceram. Soc.
0002-7820 78
(8
), pp. 2015
–2020
.14.
Kumbera
, T. G.
, Cherukuri
, H. P.
, Patten
, J. A.
, Brand
, C. J.
, and Marusich
, T. D.
, 2001, “Numerical Simulations of Ductile Machining of Silicon Nitride with a Cutting Tool of Defined Geometry
,” Mach. Sci. Technol.
1091-0344, 5
(3
), pp. 341
–352
.15.
Kitagawa
, T.
, and Maekawa
, K.
, 1990, “Plasma Hot Machining for New Engineering Materials
,” Wear
0043-1648, 139
, pp. 251
–267
.16.
Moriwaki
, T.
, Shamoto
, E.
, and Inoue
, K.
, 1992, “Ultra precision Ductile Cutting of Glass by Applying Ultrasonic Vibration
,” CIRP Ann.
0007-8506, 41
(1
), pp. 141
–144
.17.
Yoshino
, M.
, Aoki
, T.
, Sugishima
, T.
, and Shirakashi
, T.
, 1999, “Scratching Test on Hard-brittle Materials Under High Hydrostatic Pressure
,” Int. J. Jpn. Soc. Precis. Eng.
0916-782X, 65
(10
), pp. 1481
–1485
.18.
Yoshino
, M.
, Aoki
, T.
, and Shirakashi
, T.
, 2001, “Scratching Test of Hard-brittle Materials Under High Hydrostatic Pressure
,” J. Manuf. Sci. Eng.
1087-1357, 123
, pp. 231
–239
.19.
Yoshino
, M.
, and Kitamura
, G.
, 2002, “Ductile Mode Machining of Hard-Brittle Materials under High Hydrostatic Pressure (Part 1)
,” Int. J. Jpn. Soc. Precis. Eng.
0916-782X, 68
(9
), pp. 1236
–1240
.20.
Yoshino
, M.
, Kitamura
, G.
, and Ogawa
, Y.
, 2002, “Ductile Mode Machining of Hard-Brittle Materials under High Hydrostatic Pressure (Part 2)
,” Int. J. Jpn. Soc. Precis. Eng.
0916-782X, 68
(10
), pp. 1351
–1355
.21.
Hayashi
, K.
, Tsujimoto
, S.
, Okamoto
, Y.
, and Nishikawa
, T.
, 1991, “Fracture Toughness of Single Crystal Silicon
,” J. Soc. Mater. Sci. Jpn.
0514-5163, 40
(451
), pp. 405
–410
.22.
Tabor
, D.
, 1985, Micro indentation Techniques in Materials Science and Engineering
, Peter J.
Blau
and Brian R.
Lawn
, eds., ASTM
, Philadelphia.23.
Abdel-Aal
, H. A.
, Smith
, S. T.
, and Patten
, J. A.
, 1997, “On the Development of Surface Temperatures in Precision Single-Point Diamond Abrasion of Semiconductors
,” Int. Commun. Heat Mass Transfer
0735-1933, 24
(8
), pp. 1131
–1140
.24.
Bridgman
, P. W.
, 1947, “The effect of Hydrostatic Pressure on the Fracture of Brittle Substances
,” J. Appl. Phys.
0021-8979, 18
, pp. 246
–259
.25.
Sakata
, M.
, and Aoki
, S.
, 1973, “Torsional Strength of Glass under Hydrostatic Pressure,” Transactions of the ASME. Series H
, J. Eng. Mater. Technol.
0094-4289, 95
(2
), pp. 83
–86
.26.
Puttick
, K. E.
, Rudman
, M. R.
, Smith
, K. J.
, Franks
, A.
, and Lindsey
, K.
, 1989,“Single-point Diamond Machining of Glasses
,” Proc. R. Soc. London, Ser. A
1364-5021, 426
, pp. 19
–30
.27.
Puttick
, K. E.
, Shahid
, M. A.
, and Hosseini
, M. M.
, 1979, “Size Effects in Abrasion of Brittle Materials
,” J. Phys. D
0022-3727, 12
, pp. 195
–202
.28.
Puttick
, K. E.
, 1979, “Energy scaling, Size Effects and Ductile-brittle Transitions in Fracture
,” J. Phys. D
0022-3727, 12
, pp. L19
–L23
.29.
Naga
, Chandrasekaran
, Masahiko
, Yoshino
, Takayuki
, Aoki
, and Ranga
, Komanduri
, Micro Crack-free Scratching of Silicon under External Hydrostatic Pressure
, Proc. ASPE
2000 (Annual Meeting Scottsdale
, Arizona), pp. 78
–81
.30.
Zhang
, L.
, and Zarudi
, I.
, 2001,“Towards a Deeper Understanding of Plastic Deformation in Mono-crystalline Silicon
,” Int. J. Mech. Sci.
0020-7403 43
, pp. 1985
–1996
.31.
Mann
, A. B.
, Van Heerden
, D.
, Pethica
, J. B.
, Bowes
. P.
, and Weihs
, T. P.
, 2002, “Contact Resistance and Phase Transformation during Nano Indentation of Silicon
,” Philos. Mag. A
0141-8610, 82
(10
), pp. 1921
–1929
.32.
Kailer
, A.
, Gogotsi
, Y. G.
, and Nickel
, K. G.
, 1997, “Phase Transformations of Silicon caused by Contact Loading
,” J. Appl. Phys.
0021-8979 81
(7
), pp. 3057
–3063
.33.
Gogotsi
, Y.
, Baek
, C.
, and Kirscht
, K.
, 1999, “Raman Micro Spectroscopy Study of Processing-induced Phase Transformations and Residual Stress in Silicon
,” Semicond. Sci. Technol.
0268-1242 14
, pp. 936
–944
.34.
Lucazeau
, G.
, and Abello
, L.
, 1997, “Micro-Raman Analysis of Residual stresses and Phase Transformations in Crystalline Silicon under Micro Indentation
,” J. Mater. Res.
0884-2914, 12
(9
), pp. 2262
–2273
.35.
Bessen
, J. M.
, Mokhtari
, E. H.
, Gonzalez
, J.
, and Weill
, G.
, 1987, “Electrical Properties of Semi Metallic Silicon III and Semi Conductive Silicon IV at Ambient Pressure
,” Phys. Rev. Lett.
0031-9007, 59
(4
), pp. 473
–476
.36.
Kingma
, K. J.
, Meade
, C.
, Hemley
, R. J.
, Mao
, H. K.
, and. Veblen
, D. R.
, 1993, “Microstructural Observations of α-quartz Amorphization
,” Science
0036-8075, 259
(29
), pp. 666
–669
.37.
Gogatsi
, Y. G.
, Kailer
, A.
, and Nickel
, K. G.
, 1997, “Phase Transformations in Materials Studied by Micro-Raman Spectroscopy of Indentations
,” Mater. Res. Innovations
1432-8917, 1
, pp. 3
–9
.38.
Patten
, John
, 1998, “Cutting Tool Edge Radius and Depth of Cut Influence on the Generation of High Pressure Phase Transformation during Ductile Machining
,” Proceedings ASPE Spring Topical Meeting on Silicon Machining
, 17
, pp. 88
–91
.Copyright © 2005
by American Society of Mechanical Engineers
You do not currently have access to this content.
