This paper discusses substituting grinding for lapping in machining processes of silicon wafers. To attain this goal, the rotating wafer grinding method, in which a rotating wafer is ground by continuous infeed of a cup wheel, is investigated. The parallelism of a silicon wafer ground by this method is within 2 μm for a 5 in. (125 mm) wafer.
Issue Section:
Research Papers
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Copyright © 1991
by The American Society of Mechanical Engineers
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