... analysis heat transfer micromechanical devices optimisation transport processes 25 08 2010 23 05 2011 13 01 2012 13 01 2012 Total cooling energy consumption of adaptable and traditional designs for 9 years [( 50 )]. Cross signs show that the reliability requirement...

... as they have the potential to handle very high heat fluxes and offer effective thermal conductivities exceeding that of diamond. heat pipe electronic cooling evaporation cooling copper electrodeposition finite element analysis heat pipes micromechanical devices nanofabrication...

...Yogendra Joshi; Mohamed-Nabil Sabry 07 03 2011 07 03 2011 convection cooling foams heat sinks microfabrication micromechanical devices two-phase flow This special issue of the Journal of Heat Transfer contains six papers selected out of the 53 presented at the Second...

... include the axial length, temperature range, mass flow rate, and working fluid. 04 02 2009 01 10 2009 10 08 2010 10 08 2010 cryogenics flow through porous media heat exchangers heat transfer micromechanical devices plates (structures) perforated plate heat exchanger...

... in a four-point sensing configuration, where the current is flowed through the outside connections and the voltage is measured across the inner ones. 18 05 2009 10 12 2009 28 04 2010 28 04 2010 elemental semiconductors finite element analysis heat conduction micromechanical...

.../j.ijheatmasstransfer.2007.01.052 19 06 2009 23 09 2009 09 03 2010 09 03 2010 annealing capillarity carbon nanotubes cooling micromechanical devices temperature measurement thermal management (packaging) thermometers thermometer carbon nanotube wick structure...

... 2009 26 08 2009 heat transfer jets micromechanical devices orifices (mechanical) electronics cooling microscale jet heat transfer microjet orifice pressure loss coefficient Due to the increasing power consumption and decreasing size of electronic chips, cooling...

... 03 2009 forced convection heat exchangers lithography microchannel flow micromechanical devices silicon sputter etching microchannel cooler constructal theory fractal geometry constructal trees electronic cooling single phase forced convection GaN SiC In recent...

... apparent thermal conductivity than a silica aerogel, which has an apparent thermal conductivity of 0.03   W / m   K when the cold-side temperature is 294 K ( 5 ). micro-insulation MEMS microscale cells (electric) heat conduction insulation micromechanical devices...

... between the two measurements, which arise from the geometry of the test structures and electrical contacts, are explained by bond pad heating and thermal resistance effects. 27 03 2008 09 12 2008 11 02 2009 micromechanical devices silicon thermal conductivity thermal...

... thermocouple microhotplate calibration contact resistance micromechanical devices probes thermal conductivity thermal conductivity measurement thermal resistance thermal resistance measurement thermocouples 26 03 2007 13 11 2007 03 07 2008 The authors thank...

... micromechanical devices nucleate boiling bubble behavior MEMS artificial cavity Since boiling heat transfer has a high heat transfer coefficient, it has been used as a cooling technique for high-temperature bodies. The boiling phenomena have been investigated for more than 60 – 70 years...

... 2008 cooling diffusion evaporation flow through porous media heat transfer latent heat mass transfer membranes microfluidics micromechanical devices polymers supports microtruss architecture latent heat transfer mass transfer pore diffusion MEMS nanotechnology membrane...

...-phonon processes in thermal boundary conductance at high temperatures. alumina aluminium chromium dielectric materials interface phonons micromechanical devices phonon-phonon interactions platinum silicon thermal conductivity thermoreflectance thermal boundary conductance diffuse...

... 6 7 8 ). micro-column arrays emissivity blackbody spectrum space thermal analysis micromechanical devices temperature control aerospace components lightweight structures temperature distribution laser materials processing surface treatment emissivity finite element...

... silicon elemental semiconductors micromechanical devices coherent antiStokes Raman scattering spectral line breadth thermal stresses calibration spectral methods of temperature measurement stress effects Raman spectroscopy MEMS thermometry thermal stresses Recent developments...

... evaporation heat pipes LIGA cooling channel flow micromechanical devices gravity lithography electrodeposition Channel Flow Evaporation Heat Transfer Heat Pipes Microscale Evaporative cooling devices such as heat pipes and capillary pumped loops utilize capillary suction to draw...

... micromechanical devices integrated circuits optoelectronic devices Conduction Heat Transfer Interface Measurement Techniques Microscale Nanoscale Thin Films The last 50 years have witnessed the transformation of solid-state devices from objects of mere scientific curiosity to being...

... the transient bubble nucleation behavior in the micro-scale and compared with experimental measurements. 26 April 2001 18 October 2001 silicon bubbles resistors micromechanical devices integrated circuit packaging Bubble Growth Heat Transfer Microscale Phase Change Transient...

... August 6, 2001. Associate Editor: A. Majumdar. 18 December 2000 06 August 2001 adhesion micromechanical devices laser beam applications high-speed optical techniques maintenance engineering stiction Experimental Laser Microscale Microstructures Surface Adhesion...