... for the silicon-on-insulator (SOI) transistor, in which a thin silicon layer is deposited on top of a silicon dioxide layer, thus allowing faster device switching speeds due to the reduced capacitive coupling with the substrate. SOI technology reduces electronic leaking and enhances the electrostatic...

... sequence. e-mail: ch.richter@tu-bs.de e-mail: lienhard@mit.edu 04 08 2004 10 02 2005 temperature control distributed parameter systems integrated circuit testing integrated circuit packaging thermal management (packaging) conduction control electronics heat...

... of the contribution from the top finned surface of the enhanced structure. 04 05 2004 02 02 2005 dielectric liquids boiling two-phase flow heat transfer channel flow curve fitting Boiling Electronics Enhancement Experimental Heat Transfer Microstructures Thome , J. R...

... Fourier analysis Conduction Electronics Heat Transfer Microscale Modeling Nanoscale The full phonon dispersion model has been applied to study the problem of self-heating in a submicron silicon on insulator transistor 45 . The thermal predictions are compared to those obtained from...

... vapour pressure flow simulation porosity equations of state Electronics Heat Pipes Phase Change Three-Dimensional Transient Heat pipes are widely used in electronics cooling applications, both as efficient heat spreaders and to transport heat to remote heat sinks for dissipation...

.... hydrodynamics heat transfer Channel Flow Conjugate Electronics Heat Transfer Heat Exchangers Because the pin fins double as structural members in turbine blades, they normally span the full distance between the upper and lower endwalls as shown in Fig. 1...

... by the Heat Transfer Division July 15, 2002; revision received February 14, 2003. Associate Editor: S. P. Vanka. jets cooling heat transfer temperature distribution flow simulation Navier-Stokes equations Convection Electronics Heat Transfer Impingement Numerical Methods Jet...

...G. Desrayaud; A. Fichera This paper presents the numerical predictions of heat transfer and fluid flow characteristics for natural convection in a vertical channel with two-dimensional protruding heat-flux module as applied to the cooling of electronic components. The investigation...

... December 17, 2001; revision received July 3, 2002. Associate Editor: D. Poulikakos. 17 December 2001 03 July 2002 29 01 2003 infrared imaging finite element analysis liquid films Electronics Heat Transfer Microscale Microstructures Nanoscale Nonintrusive Diagnostics...

... 2002 29 01 2003 heat transfer boiling two-phase flow cooling flow through porous media channel flow Boiling Electronics Enhancement Experimental Heat Transfer Microstructures Enhanced structures are often used to improve the two-phase heat transfer, over plain...

... and a conservative basis for design. Our focus is on temperature under test conditions. During testing, the packaged device is held in a test socket which is itself temperature controlled to the desired test temperature. The socket is thermally isolated from the test electronics 1 5 . 1 Typical cross...

... thermal conductivity thermoreflectance Computational Electronics Experimental Heat Transfer Thin Films The performance of electronic and telecommunication devices depends heavily on electro-thermal interactions, making the knowledge of material properties fundamental to the design...

...T. S. Fisher; D. G. Walker This paper considers the theory of electron field emission from nanoscale emitters with particular focus on thermal and electrical energy transport. The foundational theory of field emission is explored, and a model is presented that accounts explicitly for the energy...

...S. I. Haider; Yogendra K. Joshi; Wataru Nakayama This study presents a model for the two-phase flow and heat transfer in the closed loop, two-phase thermosyphon (CLTPT) involving co-current natural circulation. The focus is on CLTPTs for electronics cooling that exhibit complex two-phase flow...

... larger than a prediction using the heat diffusion equation for the entire domain. The disparity results both from phonon-boundary scattering and from the small dimensions of the region of strongest electron-phonon energy transfer. This work clearly shows the importance of sub-continuum heat conduction...

... electronic components. Comparisons of the obstacle mean Nusselt numbers are made with a two-dimensional laminar numerical model employing the Navier-Stokes equations. A set of correlations characterizing the heat transfer from the protruding heat sources within the channel is obtained. It was found...

... and point to that it can be optimized geometrically. The path can be arranged optimally in space. The geometric optimization of assemljlies of heat-generating components is also an essential feature of many of the more recent contributions to the cooling of electronics (e.g., Bar- Cohen and Rohsenow, 1984...

... and greases have also been implemented. This review article covers recent developments in heat sink designs and applications intended for high-end high-power dissipation systems. A review of recent studies of card effects in the thermal enhancement of electronic packages is also presented. In certain...

... network that is completely deterministic. 30 Dec 1997 24 June 1998 05 12 2007 Conduction Cooling Electronics Finned Surfaces Heat Transfer Thermodynamics Aung, W., ed., 1988, Cooling Technology for Electronic Equipment , Hemisphere, New York. Bejan A. , 1997...

... 1998 05 12 2007 Electronics Finned Surfaces Heat Transfer Natural Convection Optimization Aihara T. , Maruyama S. , and Kobayakawa S. , 1990 , “ Free Convective/Radiative Heat Transfer from Pin-Fin Arrays with a Vertical Base Plate (general representation of heat...