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Keywords: through ceramic via (TCV)
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021004.
Paper No: EP-24-1071
Published Online: December 20, 2024
...Pan Ren; Chulin Wang; Yaya Liang; Xuan Zhao; Xiaojie Li; Du Pingan There are numbers of through ceramic vias (TCVs) in ceramic package substrates for vertical interconnection of signal, and it would be very difficult, even impossible, to create the full-wave three-dimensional (3D) model of all TCVs...