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Keywords: thermal management (packaging)
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041015.
Published Online: December 23, 2011
... element analysis microprocessor chips semiconductor device models semiconductor device packaging silicon temperature distribution thermal analysis thermal management (packaging) transistors integrated circuit (IC) silicon chip hot spot thermal modeling multilevel modeling High...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041009.
Published Online: December 9, 2011
.... Q. , and Liu , J. , 2007 , “ Nano Liquid-Metal Fluid as Ultimate Coolant ,” Phys. Lett. A , 361 , pp. 252 – 256 . 10.1016/j.physleta.2006.09.041 24 05 2011 16 09 2011 09 12 2011 09 12 2011 cooling forced convection liquid metals thermal management...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041011.
Published Online: December 9, 2011
...  = without W2W  = wafer-to-wafer integrated circuit packaging thermal management (packaging) three-dimensional integrated circuits 3D chip stacks thermal management through-silicon-vias (TSVs) 3D integration Three dimensional (3D) integration offers many benefits over a two...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041008.
Published Online: December 9, 2011
... 13 05 2011 10 08 2011 09 12 2011 09 12 2011 minimisation thermal management (packaging) thermal resistance Constructal theory is the view that the generation of flow configurations is a physics phenomenon that can be based on a physics principle (the Constructal law...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041005.
Published Online: December 9, 2011
... thermal management (packaging) thermoelectric devices Application of electronic devices for data acquisition during oil exploration helps mitigate risk factors associated with drilling operations [( 1 2 3 4 5 6 )]. Electronic devices are typically placed just above the drill bit...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021008.
Published Online: June 23, 2011
..., it is found that the effects of variation in substrate material properties are negligible. 04 05 2010 18 01 2011 23 06 2011 23 06 2011 bronze heat transfer microchannel flow nitrogen silicon compounds slip flow thermal conductivity thermal management (packaging...
Journal Articles
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011006.
Published Online: March 9, 2011
... brightness computational fluid dynamics cooling light emitting diodes optimisation printed circuits semiconductor device packaging thermal management (packaging) light-emitting diode printed circuit board LED array thermal modeling Light-emitting diodes (LEDs) demonstrate a number...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2011, 133(1): 014501.
Published Online: March 9, 2011
... semiconductor device packaging thermal management (packaging) thermal resistance thermal stability collector-up heterojunction bipolar transistor (C-up HBT) genetic algorithm (GA) optimization packaging thermal As claimed in a classical paper ( 1 ), an inverted transistor design...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011007.
Published Online: March 9, 2011
... dynamics computer centres cooling electric conduits thermal management (packaging) Figure 1 demonstrates air flow patterns in a typical raised floor data center. In this type of arrangement, the computer room air conditioning (CRAC) units push cold air into the plenum, from where...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011003.
Published Online: March 3, 2011
... “tables” of the CFD software. Results for each of the cases are discussed below. 22 02 2010 12 11 2010 03 03 2011 03 03 2011 computational fluid dynamics electronics packaging natural convection thermal analysis thermal management (packaging) DELPHI multisource...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041009.
Published Online: November 24, 2010
.... diamond fluid oscillations gold heat pipes microfluidics pipe flow thermal management (packaging) thermal resistance 06 04 2010 31 07 2010 24 11 2010 24 11 2010 2010 American Society of Mechanical Engineers ...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031011.
Published Online: September 30, 2010
... nanosilver joint 16 11 2009 06 07 2010 30 09 2010 30 09 2010 bonding processes light emitting diodes semiconductor device reliability silver thermal management (packaging) high-power LED die shear die-attach material reliability Light emitting diode (LED...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031006.
Published Online: September 9, 2010
.... 127 – 136 . 23 12 2009 24 02 2010 09 09 2010 air conditioning computer centres cooling power consumption thermal management (packaging) data center energy efficiency coordinated optimization IT power minimization workload distribution Data centers...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2010, 132(2): 024501.
Published Online: June 23, 2010
... reliability thermal management (packaging) In recent years, cooling of high heat flux systems such as computer microprocessors and memory have become global challenges because the demand for multitasking and faster computation is inversely proportional to the package size. This phenomenon has become...
Journal Articles