... finite element analysis microprocessor chips semiconductor device models semiconductor device packaging silicon temperature distribution thermal analysis thermal management (packaging) transistors integrated circuit (IC) silicon chip hot spot thermal modeling multilevel modeling...

... to and from the refrigerant. ( a ) Schematic and ( b ) actual setup of a miniature vapor compression heat pump microelectronics cooling solution [( 33 )] integrated circuit packaging thermal management (packaging) three-dimensional integrated circuits 3D chip stacks thermal...

... management (packaging) thermal resistance liquid metal thermosyphon effect thermal management chip cooling LED self support heat driven heat transfer enhancement With the rapid progress of the micro/nano electronics, power density of electronic components has increased year by year...

... thermal resistance and optimal shapes as function of the ratio t 1 /t 0 13 05 2011 10 08 2011 09 12 2011 09 12 2011 minimisation thermal management (packaging) thermal resistance Constructal theory is the view that the generation of flow configurations...

... supply to the TE device for a desired steady state temperature of chip and a desired cooling COP. 15 06 2010 19 07 2011 09 12 2011 09 12 2011 cooling heat exchangers oil drilling thermal management (packaging) thermoelectric devices Application of electronic...

... 2011 26 09 2011 26 09 2011 embedded systems hybrid integrated circuits integrated circuit interconnections integrated optoelectronics optical interconnections printed circuits system-in-package thermal management (packaging) three-dimensional integrated circuits...

..., it is found that the effects of variation in substrate material properties are negligible. bronze heat transfer microchannel flow nitrogen silicon compounds slip flow thermal conductivity thermal management (packaging) conjugate uniform heat flux gas slip flow long microchannel...

... arrays; precise alignment of CNTs is not a stringent requirement. These structures are relatively inexpensive and compatible with large scale manufacturing [( 10 )]. carbon nanotubes flexible electronics light emitting diodes thermal management (packaging) thin film transistors 23 10...

... thermal conductivity thermal management (packaging) 04 04 2010 23 03 2011 07 06 2011 07 06 2011 2011 American Society of Mechanical Engineers ...

... Systems (ITherm), 2010. cooling heat transfer network servers thermal management (packaging) 07 04 2010 02 12 2010 09 03 2011 09 03 2011 The power demand of the cooling tower pumps can be determined by Eq. 20 using the pressure drop in the cooling tower water...

... computational fluid dynamics cooling light emitting diodes optimisation printed circuits semiconductor device packaging thermal management (packaging) light-emitting diode printed circuit board LED array thermal modeling Light-emitting diodes (LEDs) demonstrate a number of benefits...

.... 29 05 2010 03 12 2010 09 03 2011 09 03 2011 cooling gallium arsenide gallium compounds genetic algorithms heterojunction bipolar transistors III-V semiconductors indium compounds semiconductor device packaging thermal management (packaging) thermal resistance thermal...

... floor to minimize the leakage flow through the perimeter ( 7 ). 13 10 2009 02 12 2010 09 03 2011 09 03 2011 computational fluid dynamics computer centres cooling electric conduits thermal management (packaging) Figure 1 demonstrates air flow patterns...

... Characterization using Dedicated Optimization Software ,” Proceedings of SEMITHERM XV , San Diego, CA, pp. 189 – 200 . 22 02 2010 12 11 2010 03 03 2011 03 03 2011 computational fluid dynamics electronics packaging natural convection thermal analysis thermal management...

.... diamond fluid oscillations gold heat pipes microfluidics pipe flow thermal management (packaging) thermal resistance 06 04 2010 31 07 2010 24 11 2010 24 11 2010 2010 American Society of Mechanical Engineers ...

.... 16 – 24 . 10.1117/12.593696 16 11 2009 06 07 2010 30 09 2010 30 09 2010 bonding processes light emitting diodes semiconductor device reliability silver thermal management (packaging) high-power LED die shear die-attach material reliability Light...

... consumption thermal management (packaging) data center energy efficiency coordinated optimization IT power minimization workload distribution Data centers, as shown in Fig. 1 , are computing and telecommunications infrastructure facilities that house arrays of electronic racks containing...

...) and operating at higher clock speed, higher Δ T can be realized. Based on this paper’s analysis, the optimized scenario resulted in a junction temperature of 56.6 ° C at the cost of a 14% performance loss. delays integrated circuit packaging microprocessor chips minimisation thermal management (packaging...

... . 16 01 2010 18 05 2010 23 06 2010 23 06 2010 cooling integrated circuit packaging integrated circuit reliability thermal management (packaging) In recent years, cooling of high heat flux systems such as computer microprocessors and memory have become global...

... the chances for TIM delamination. 21 01 2010 06 05 2010 11 06 2010 11 06 2010 assembling ball grid arrays electronics industry finite element analysis moisture polymers reliability thermal management (packaging) thermal resistance thermal interface material debonding...