...; published online September 6, 2013. Assoc. Editor: Yi-Shao Lai. 10 04 2013 25 07 2013 The feasibility of laser direct welding quad flat pack (QFP) device without solder is analyzed and practiced. The relations between the tensile strength of QFP joints and laser welding parameters...

... was found to describe the observed behavior with much higher fidelity than the common Johnson–Cook model. 14 09 2010 13 05 2011 23 09 2011 deformation eutectic alloys lead alloys solders tensile strength tin alloys Stephens and Frear [( 31 )] studied the creep behavior...

... strength copper alloys creep elastoplasticity electronics packaging fatigue mechanical testing silver alloys solders tensile strength tin alloys lead-free solder alloy elastic-plastic-creep constitutive model time-independent strain time-dependent strain cyclic plasticity stress...

...Sheng Liu; Wenming Liu; Changyong Lin; Mingxiang Chen A novel ceramic packaging technology by using selective induction heating is presented. Some aspects of this packaging process, including local temperature distribution, hermeticity, tensile strength, and fracture analysis, were tested...

... are strongly strain rate dependent: Their tensile strength, percent elongation, and percent reduction in area are much greater than those properties of the lead-containing solder at high strain rates. Tummala , R. R. , Rymaszewski , E. J. , and Klopfenstein , A. G. , 1997...

... with tensile strength up to 71 MPa. The potential application of BCB bonding is demonstrated on a concept of wafer-level chip-scale package for RF applications and microfilter array for microfluidic applications. Manuscript received January 6, 2004; revision received June 8, 2004. Review conducted by: Y...

...Haruo Nose, Lecturer,; Masao Sakane, Professor,; Yutaka Tsukada, Researcher; Hideo Nishimura, Researcher This paper describes the tensile strength and inelastic constitutive relationship of six types of Sn-Pb solders. Static tension tests were carried using 5Sn-95Pb, 10Sn-90Pb, 40Sn-60Pb, 60Sn-40Pb...

... circuit reliability filled polymers diffusion moisture moulding sorption plasticity Young's modulus tensile strength bending strength Moisture sorption in molding compounds employed in plastic packaging of integrated circuit (IC) devices has been treated by the majority of investigators...