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Keywords: surface cleaning
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 120–123.
Published Online: April 30, 2004
... Waals forces or hydrogen bonding) is replaced by higher strength bonding such as covalent bonding 3 . glass silicon wafer bonding surface cleaning annealing surface roughness thermal expansion atomic force microscopy 01 April 2003 01 September 2003 30 04 2004...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 355–361.
Published Online: December 12, 2002
... by the Electronic and Photonic Packing Division and presented at Poly 2000, London, United Kingdom, December 4–5, 2000. Manuscript received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 ice surface cleaning surface contamination...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 2002, 124(3): 314.
Published Online: July 26, 2002
...Howard H. Manko,, Author; Anthony J. Rafanelli,, Reviewer 26 07 2002 soldering lead materials properties bismuth alloys silver alloys indium alloys surface cleaning Solders and Soldering, Fourth Edition , by Howard H. Manko. McGraw-Hill, New York, NY, 2001, 519 pp...
