1-16 of 16
Keywords: printed circuit design
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041010.
Published Online: December 9, 2011
... of the accelerometer, due to drop loading 12 03 2010 13 04 2011 09 12 2011 09 12 2011 assembling failure analysis finite element analysis printed circuit design transient response vibrations Portable electronic devices are frequently subjected to unintentional drops...
Journal Articles
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2010, 132(1): 016501.
Published Online: March 19, 2010
... circuit reliability integrated circuit testing life testing printed circuit design printed circuit testing semiconductor device packaging semiconductor device reliability This book entitled “ Mechanical Design of Electronic Systems ” is written from a mechanical design perspective to introduce...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021007.
Published Online: May 8, 2008
...) Difference (%) 124.64 120.81 − 3.07 124.17 0.377 Free boundary condition 30 03 2007 10 09 2007 08 05 2008 circuit reliability circuit simulation elastic moduli printed circuit design printed circuit testing solders PCB FE simulation...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 90–97.
Published Online: April 19, 2006
...) Placement optimization results from Step 1 12 12 2005 19 04 2006 printed circuit design thermal management (packaging) genetic algorithms neural nets circuit optimisation electronic component placement artificial neural networks application genetic algorithm application...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 449–455.
Published Online: February 15, 2006
... positions. Although relatively large differences between the calculated, optimized fundamental frequencies and the experimental values are observed, the experiments confirm a very significant improvement in frequency for both cases. 09 10 2005 15 02 2006 printed circuit design cooling...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 339–345.
Published Online: January 8, 2006
... , ITHERM 2002, May 30-June 1, 2002, pp. 940 – 945 . Ramamrutham , S. , and Narayan , R. , 1992 , Strength of Materials , Danpat Rai , New Delhi, India. 29 03 2005 08 01 2006 printed circuit design printed circuit testing electronics packaging failure analysis life...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 524–527.
Published Online: January 24, 2005
.... The advantage this process offers is also described by considering a PWBA (Printed Wiring Board Assembly) design, such as layout and layup in an electrical design system. printed circuits printed circuit design product development circuit analysis computing thermal analysis electrical engineering...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 282–287.
Published Online: October 6, 2004
... circuit testing printed circuit manufacture finite element analysis thermoelasticity printed circuit design Printed circuit boards (PCB’s) are generally constructed using two types of routing strategies depending on the complexity of a design: X-Y or Maze routing. As shown in Fig. 1 , the X-Y...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 362–368.
Published Online: September 17, 2003
... Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received June 2001; final revision, December 2001. Associate Editor: A. Y.-H. Hung. 01 June 2001 01 December 2001 17 09 2003 modules forced convection printed circuit design wakes...
Journal Articles
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 388–393.
Published Online: November 1, 2000
... printed circuit manufacture printed circuit design surface mount technology Substrate fixture tooling refers to a specialized mechanical and/or vacuum device that constrains a flexible substrate and minimizes assembly process defects due to misregistration resulting from three-dimensional...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2001, 123(2): 132–140.
Published Online: September 14, 2000
... optimisation finite element analysis matrix decomposition circuit analysis computing printed circuit design New products are pushing density and speed of electronic packages to the limits. To support this evolution, packaging technologies are moving at a rapid pace. It is believed by the year 2012...
Journal Articles
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 2000, 122(2): 178–179.
Published Online: June 1, 2000
... BY: ANTHONY J. RAFANELLI packaging reviews printed circuit design thermal management (packaging) interconnections electric connectors 2000 ASME ...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2001, 123(2): 156–158.
Published Online: March 31, 2000
... electronic device mounted on a circuit board. The model includes a flush-mounted heater to represent the electronic device, a two-layer substrate to represent the circuit board, and a steady shear flow to represent the cooling fluid. printed circuit design forced convection cooling temperature...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 341–349.
Published Online: February 25, 2000
... of the fundamental natural frequency upward has the desirable effect of reducing dynamic displacements, and thereby increases the fatigue life of the mounted components 1 . vibrations modal analysis supports optimisation printed circuit design 2000 ASME ...
Journal Articles
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 356–365.
Published Online: December 20, 1999
... December 20, 1999. Associate Editor: Y. Joshi. 20 December 1999 printed circuit testing heat transfer forced convection cooling printed circuit design As electronics become more prevalent and ubiquitous in everyday life, they are required to operate under an ever widening...
Journal Articles