...Saketh Mahalingam; Ananth Prabhakumar; Sandeep Tonapi; Suresh K. Sitaraman The occurrence of passivation-underfill interfacial delamination is detrimental to the reliability of the flip chip assembly as it can result in the premature cracking of the solder bumps. In this paper, the propagation...

... the solder bump reliability, if the underfills do not prematurely delaminate or crack. Therefore, it is necessary to understand the risk of underfill delamination during assembly and during further thermal excursions. In this paper, the interface between silicon nitride ( SiN ) passivation and a nano-filled...

... the mechanical reliability of flip chip using anisotropic conductive films (ACFs) often depends upon the interface characteristics between the bumping/passivation dielectrics and adjacent materials. This paper investigates the delamination and cracking in polymeric bumping/passivation dielectrics (Cyclotene™...