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Keywords: neural nets
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011010.
Published Online: March 10, 2011
... natural convection neural nets two-phase flow Recently, artificial neural networks (ANNs) have become increasingly prevalent in solving engineering problems particularly in natural convection heat and flow processes ( 17 18 19 20 ) with a considerable reduction in computation time. ANNs...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041002.
Published Online: November 19, 2010
... of ultrasonic vibrations to the bonding interface ( 1 ). wire bonding bonding electrical signal feature extraction principal components analysis bond quality band-pass filters data acquisition electronics packaging feature extraction Hilbert transforms lead bonding neural nets principal...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Technology Review
J. Electron. Packag. September 2008, 130(3): 034001.
Published Online: July 30, 2008
... they require intensive computational effort. Advantages as well as disadvantages of these methods are discussed. 05 06 2007 06 12 2007 30 07 2008 design of experiments electronic design automation electronics packaging neural nets numerical analysis optimisation...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 90–97.
Published Online: April 19, 2006
... design thermal management (packaging) genetic algorithms neural nets circuit optimisation electronic component placement artificial neural networks application genetic algorithm application Placement of heat generating electronic components on a printed circuit board (PCB) is a task...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 306–313.
Published Online: November 16, 2004
... , 7 ( 4 ), pp. 319 – 336 . 20 10 2003 16 11 2004 ball grid arrays thermal management (packaging) neural nets optimisation Multidisciplinary Design Electronics Packaging Neural Networks Design Optimization Ball Grid Array Current trends in electronics...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 6–12.
Published Online: December 9, 1999
..., 1999. Associate Technical Editor: Y. Joshi. 29 July 1998 09 December 1999 packaging reliability soldering design engineering neural nets fatigue moire fringes The fatigue life of solder joints in an area array package depends on the geometric shape, the choice...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 13–19.
Published Online: August 13, 1999
... and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EEPD February 10, 1999; revision received August 13, 1999. Associate Technical Editor: B. Courtois. 10 February 1999 13 August 1999 packaging modules neural nets finite...