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Keywords: matrix algebra
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021008.
Published Online: May 9, 2008
... analysis flip-chip devices matrix algebra thermal expansion thermal stresses time-frequency analysis A successful solution to meeting the demand for high inputs/outputs ( I ∕ Os ) , high packaging density, better electrical performance, and low cost manufacturability, is flip chip...
