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Keywords: materials properties
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 278–286.
Published Online: July 20, 2006
... 63Sn–37Pb solder lead alloys materials properties mechanical testing soldering solders tin alloys work hardening 23 02 2006 20 07 2006 2007 American Society of Mechanical Engineers ...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 2002, 124(3): 314.
Published Online: July 26, 2002
...Howard H. Manko,, Author; Anthony J. Rafanelli,, Reviewer 26 07 2002 soldering lead materials properties bismuth alloys silver alloys indium alloys surface cleaning Solders and Soldering, Fourth Edition , by Howard H. Manko. McGraw-Hill, New York, NY, 2001, 519 pp...
