Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Format
Article Type
Subject Area
Topics
Date
Availability
1-4 of 4
Keywords: lead
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031014.
Published Online: July 31, 2009
... applications. Furthermore, this study provides the design guideline to develop an advanced no-flow underfill having high performance at high temperature range for the lead-free application. Spectrums of evolved gases in underfill reflow process with eutectic solders and without eutectic solders using GC-MS...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 148–158.
Published Online: April 30, 2004
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received March 2003; final revision, September 2003. Associate Editor: E. Lorenzini. 01 March 2003 01 September 2003 30 04 2004 tin lead solders elastic constants fatigue viscoplasticity Newton-Raphson method numerical analysis...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 369–377.
Published Online: September 17, 2003
... . Manuscript received May 2002. Associate Editor: Z. Suo. 01 May 2002 17 09 2003 gallium arsenide III-V semiconductors brittle fracture crack-edge stress field analysis soldering indium lead packaging finite element analysis Gallium arsenide (GaAs) semiconductors...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 2002, 124(3): 314.
Published Online: July 26, 2002
...Howard H. Manko,, Author; Anthony J. Rafanelli,, Reviewer 26 07 2002 soldering lead materials properties bismuth alloys silver alloys indium alloys surface cleaning Solders and Soldering, Fourth Edition , by Howard H. Manko. McGraw-Hill, New York, NY, 2001, 519 pp...
