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Keywords: lead
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031014.
Published Online: July 31, 2009
... applications. Furthermore, this study provides the design guideline to develop an advanced no-flow underfill having high performance at high temperature range for the lead-free application. Spectrums of evolved gases in underfill reflow process with eutectic solders and without eutectic solders using GC-MS...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 148–158.
Published Online: April 30, 2004
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received March 2003; final revision, September 2003. Associate Editor: E. Lorenzini. 01 March 2003 01 September 2003 30 04 2004 tin lead solders elastic constants fatigue viscoplasticity Newton-Raphson method numerical analysis...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 2002, 124(3): 314.
Published Online: July 26, 2002
...Howard H. Manko,, Author; Anthony J. Rafanelli,, Reviewer 26 07 2002 soldering lead materials properties bismuth alloys silver alloys indium alloys surface cleaning Solders and Soldering, Fourth Edition , by Howard H. Manko. McGraw-Hill, New York, NY, 2001, 519 pp...