... silicon chip alumina substrate adhesive bonding alumina ductility elemental semiconductors gold integrated circuit bonding scanning electron microscopy silicon thermal expansion 22 10 2010 26 02 2011 22 06 2011 22 06 2011 2011 American Society of Mechanical...

... and utilized in production. On the other hand, the preliminary results in this study show that Ag flip-chip joints can indeed be fabricated at 250 ° C . 31 08 2009 01 05 2010 30 09 2010 30 09 2010 flip-chip devices integrated circuit bonding silver joints flip-chip direct...

... technology finite elements stress analysis micromechanics elastic moduli finite element analysis gold integrated circuit bonding integrated circuit interconnections stress effects ultrasonic bonding 12 07 2008 16 09 2009 29 10 2009 2009 American Society of Mechanical...

... common for many flash memory applications ( 1 ). ball grid arrays chip scale packaging compression moulding deformation encapsulation integrated circuit bonding integrated circuit interconnections 10 07 2007 15 08 2007 12 02 2008 e-mail: amip.shah...

... 2006 active networks cracks electrical faults finite element analysis friction integrated circuit bonding integrated circuit manufacture lead bonding stress analysis A higher level of circuitry integration is the primary driving force for the semiconductor industry. Increasing...

... extensively in high-density electronics such as (PDA), mobile phone, (LCD), smart cards, and disk drives 2 . ACF Bumpless Reflow Reliability silicon conducting polymers polymer films aluminium chip scale packaging integrated circuit bonding reflow soldering adhesives adhesive...

.... 13 January 2004 03 June 2004 21 03 2005 adhesive bonding curing adhesives mechanical testing fracture ultraviolet radiation effects electronics packaging Fourier transform spectra infrared spectra integrated circuit testing integrated circuit bonding scanning electron...

... OF ELECTRONIC PACKAGING . Manuscript received May 2003 2003; final revision November 2003. Associate Editor: K. Kishimoto. 01 May 2003 01 November 2003 08 07 2004 reliability surface morphology adhesion passivation integrated circuit packaging integrated circuit bonding flip-chip...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Feb. 2003. Associate Editor: E. Suhir. 01 Feb 2003 15 12 2003 flip-chip devices integrated circuit bonding integrated circuit packaging adhesives conducting polymers particle size finite element analysis heat transfer...

... to fracture of the bonding part connecting the integrated circuit (IC) and the substrate. At present therefore assessing the reliability of electronic devices becomes an important issue. chip scale packaging thermoelasticity viscoelasticity integrated circuit bonding encapsulation finite element...

... November 1999 flip-chip devices integrated circuit packaging soldering tin alloys lead alloys thermal stress cracking encapsulation life testing printed circuit testing finite element analysis integrated circuit bonding failure analysis One of the key technologies of dense LSI...

... PACKAGING . Manuscript received by the EEPD March 15, 1999. Associate Technical Editor: B. Michel. 15 March 1999 ceramic packaging microassembling integrated circuit bonding solidification shear strength mechanical testing metallography ultrasonic materials testing acoustic...