.... In samples subjected to thermomigration, near the cold side the Cu concentration is significantly higher compared with hot side. Extensive surface hardness testing showed an increase in hardness from the hot to cold sides, which possibly indicates that Sn grain coarsening is in the same direction. 25 09...

... lead alloys tin alloys plasticity eutectic alloys indentation elastic deformation plastic deformation hardness testing integrated circuit packaging 16 06 2005 04 10 2006 The current study is motivated by the trend of miniaturization of microelectronics solder...

... interconnections indentation hardness hardness testing viscoelasticity thermomechanical treatment The copper/low- k material configuration in the interconnect structures of today’s advanced microchips often exhibits thermo-mechanical failure during fabrication or packaging. Low- k...