... integrated circuit interconnections electronic speckle pattern interferometry scanning electron microscopy flip-chip devices integrated circuit packaging displacement measurement strain measurement thermal stresses thermal expansion integrated circuit reliability image processing One...

... . Manuscript received at ASME Headquarters September 19, 2001. Associate Editor: D. T. Read. 19 September 2001 26 07 2002 electronic speckle pattern interferometry thermal management (packaging) integrated circuit packaging soldering integrated circuit reliability fatigue stress...