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Keywords: creep testing
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011008.
Published Online: February 13, 2009
... arrays copper alloys cracks creep testing fatigue testing finite element analysis integrated circuit interconnections integrated circuit packaging integrated circuit reliability life testing silver alloys solders stress-strain relations tin alloys As technology progresses, both...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 195–204.
Published Online: June 23, 2006
... shearing tests. The axial stresses are 1.5 ksi (below yielding) and 3.0 ksi (beyond yielding) in tension. The creep tests were conducted under constant stress condition at temperatures from ambient up to 125°C with a variety of shear stress levels...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 82–89.
Published Online: May 21, 2006
... in the time-dependent deformation of lead-free and lead-containing solder alloys. Uniaxial ratchetting tests were conducted by cyclic tension–compression tests or cyclic tension–unloading tests at several ratios of the maximum to minimum stresses. Additional creep tests following the uniaxial ratchetting were...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 71–75.
Published Online: May 12, 2006
.... (ii) The stress sensitivity decreases after stress relaxation in nanoindentation creep tests. The saturated value is 1 in three solder balls. (iii) The morphology of indented surface consists of three parts: initial indentation, power-law creep, and granular surface. It suggests that the transition...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2004, 126(4): 560–564.
Published Online: January 24, 2005
.... The thermomechanical properties of underfill therefore become crucial factors to the service life of FCBGA. ball grid arrays flip-chip devices failure (mechanical) integrated circuit reliability integrated circuit packaging creep testing thermal stress cracking solders Young's modulus thermal...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 407–414.
Published Online: December 24, 2004
... creep test, N is the number of cycles to failure in creep-fatigue test, and t is the loading time in creep-fatigue test. In calculating ϕ c , the torsion creep data are necessary but they are not available so that the static tension creep data shown in Fig. 5 ( 7 ) were used...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 185–188.
Published Online: October 1, 2004
... method based on the ASTM D790 three-point bending procedure was developed to predict and characterize creep of polymeric materials under low temperature, low stress, and large elapsed times. 16 09 2003 01 10 2004 creep testing printed circuits integrated circuit packaging printed...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 539–548.
Published Online: December 15, 2003
... simulations. Among the various experimental possibilities to efficiently establish the model parameter functions, in the present paper the use of unidirectional creep testing is worked out for a chosen molding compound. Here isothermal one-day creep experiments at different temperatures (ranging below...