...Hong He; Renli Fu; Yanchun Han; Yuan Shen; Deliu Wang Traditionally, large quantities of ceramic fillers are added to polymers in order to obtain high thermally conductive polymer composites, which are used for electronic encapsulants. However, that is not cost effective enough. In this study, Si 3...

... extensively in high-density electronics such as (PDA), mobile phone, (LCD), smart cards, and disk drives 2 . ACF Bumpless Reflow Reliability silicon conducting polymers polymer films aluminium chip scale packaging integrated circuit bonding reflow soldering adhesives adhesive...

... that the pressure cooker test could most effectively reveal the adhesion behavior. Manuscript received January 13, 2004; revision received November 10, 2004. Review conducted by: Y. C. Chan. 13 January 2004 10 November 2004 21 03 2005 conducting polymers flip-chip devices integrated...

... conducting polymers indium alloys tin alloys adhesives filler metals solders adhesive bonding electronics packaging curing differential scanning calorimetry As electronic packaging technologies proceed to higher density, smaller size, higher performance and lower cost, the area type package...

... many clinical DNA replications with nano-liter quantities of sample/reagent and hence is highly desirable. PCR Microchip Array Polymer Bonding DNA Amplification silicon conducting polymers micromechanical devices micromachining adhesive bonding fluorescence Raman spectra chip...

... received Feb. 2003. Associate Editor: E. Suhir. 01 Feb 2003 15 12 2003 adhesives packaging fine-pitch technology electrical conductivity conducting polymers nickel gold contact resistance The simple connection method using anisotropic conductive adhesive (ACA) is noted...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Feb. 2003. Associate Editor: E. Suhir. 01 Feb 2003 15 12 2003 flip-chip devices integrated circuit bonding integrated circuit packaging adhesives conducting polymers particle size finite element analysis heat transfer...

... received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 14 03 2003 surface mount technology printed circuit accessories printed circuit testing adhesives impact testing impact strength filled polymers conducting polymers shear...

... mount technology printed circuit manufacture Taguchi methods design of experiments mechanical properties conducting polymers In order to identify the desirable formulation and the preferred material parameters of the electrically conductive adhesives under investigation, the design...

...: S. M. Heinrich. 27 July 1999 26 07 2002 flip-chip devices adhesives fine-pitch technology conducting polymers circuit reliability environmental testing contact resistance electric resistance measurement filled polymers Conductive adhesive joining in flip-chip...