... through experimentation and finite element analysis. atomic clocks bimetals chip scale packaging discs (structures) heat conduction switches temperature control thermal management (packaging) The experiment was run once each for the corner and side resistors in air and vacuum; results...

... 2004 integrated circuit packaging bimetals solders thermal analysis fatigue finite element analysis The trend of contemporary electronic packaging is toward miniaturization and high I/O density. Advanced fabrication technologies have enabled high-density connection to a silicon chip...

... to the successful usage of FBG-based devices. In this paper, the bimetal-based temperature-compensating package with tunable mechanism was developed. Such a tunable mechanism serves as prestress and post-tuning mechanisms of fixture in order to obtain a predetermined central wavelength. With the aid of developed...