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Keywords: aluminium
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041007.
Published Online: November 24, 2010
...Christopher T. DeGroot; Derek Gateman; Anthony G. Straatman A numerical study on the effect of thermal contact resistance and its impact on the performance of finned aluminum foam heat sinks has been conducted. Calculations are based on the solution of the volume-averaged mass, momentum, and energy...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021003.
Published Online: June 11, 2010
... in group 1: ( a ) 4 N sample and ( b ) 6 N sample 20 08 2009 14 04 2010 11 06 2010 11 06 2010 aluminium electromigration sputtering thin film circuits EM high purity Al film grain boundary diffusion AFD activation energy Thin films...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021001.
Published Online: March 27, 2009
...Christopher T. DeGroot; Anthony G. Straatman; Lee J. Betchen A numerical study has been undertaken to explore the details of forced convection heat transfer in finned aluminum foam heat sinks. Calculations are made using a finite-volume computational fluid dynamics (CFD) code that solves...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 192–201.
Published Online: November 23, 2005
... wire size is around 370 J ∕ m 2 , while an aged gold ball bond consumes about 520 J ∕ m 2 . Void nucleation and coalescence mechanism of ductile fracture takes place in the ball and stitch bonds, however, silicon particles may be the preferential void nucleation sites in bond pad aluminum metallization...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 259–266.
Published Online: September 23, 2005
...A. Bhattacharya; R. L. Mahajan In this paper, we present our recent experimental results on buoyancy-induced convection in aluminum metal foams of different pore densities [corresponding to 5, 10, 20, and 40 pores per in. (PPI)] and porosities (0.89–0.96). The results show that compared to a heated...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
Published Online: June 3, 2005
... in Microelectronic Packages ,” IEEE Trans. Compon., Hybrids, and Manuf. Technol. , 13 ( 2 ), pp. 383 – 389 . Zhang , J. H. , Chan , Y. C. , Alam , M. O. , and Fu , S. , 2003 , “ Contact Resistance and Adhesion Performance of ACF Connections to Aluminum Metallization ,” Microelectron. Reliab...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 342–350.
Published Online: October 6, 2004
... experimentally and correlations for them are presented. To validate the compact model proposed in this paper, 20 aluminum pin fin heat sinks having a 101.43 mm×101.43 mm base size are tested with an inlet velocity ranging from 1 m/s to 5 m/s. In the experimental investigation, the heat sink is heated uniformly...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 247–255.
Published Online: July 8, 2004
... from forced convective flow between infinite parallel plates. To validate the compact model proposed in this paper, three aluminum straight fin heat sinks having a base size of 101.43 mm × 101.43 mm are tested with an inlet velocity ranging from 0.5 m/s to 2 m/s. In the experimental investigation...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 223–234.
Published Online: May 8, 2004
...Tzer-Ming Jeng; Li-Kang Liu; Ying-Huei Hung A novel semi-empirical model with an improved single blow method for exploring the heat transfer performance of porous aluminum-foam heat sinks in a channel has been successfully developed. The influencing parameters such as the steady-state air...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 617–620.
Published Online: December 15, 2003
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received February 2003. Associate Editor: E. Suhir. 01 February 2003 15 12 2003 gold copper aluminium integrated circuit interconnections integrated circuit packaging integrated circuit reliability ageing lead bonding hardness...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 597–601.
Published Online: December 15, 2003
... and lead-free 95.5Sn3.8Ag0.7Cu solders were used to form the bumps. No solder bridging was observed between adjacent bumps, and the solder bumps exhibited good dimensional uniformity. The solder bump to aluminum (Al) pad bond integrity was found to be excellent, as evidenced by the high stress to failure...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 155–163.
Published Online: July 26, 2002
...A. Bhattacharya, Research Assistant; R. L. Mahajan, Professor In this paper, we present recent experimental results on forced convective heat transfer in novel finned metal foam heat sinks. Experiments were conducted on aluminum foams of 90 percent porosity and pore size corresponding to 5 PPI (200...
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. June 2002, 124(2): 127–134.
Published Online: May 2, 2002
... for Bonding , AGARD Lecture Series No. 102, AGARD, Harford House, London, Ch. 7. Venables , J. D. , 1984 , “ Adhesion and durability of metal-polymer bonds ,” J. Mater. Sci. , 19 , p. 2431 2431 . Brockmann , W. , 1986 , “ Adhesion in bonded aluminum joints for aircraft construction...