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Keywords: SOC
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Journal Articles
Article Type: Guest Editorial
J. Electron. Packag. June 2018, 140(2): 020301.
Paper No: EP-18-1012
Published Online: May 9, 2018
... or reproduce the published form of this work, or allow others to do so, for United States Government purposes. 16 02 2018 21 02 2018 3D packaging Battery technology Harsh environment High density interconnects Microsystems Optoelectronics Power packaging Sensors SOC Wafer level...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041002.
Paper No: EP-17-1042
Published Online: July 27, 2017
... and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received April 13, 2017; final manuscript received July 8, 2017; published online July 27, 2017. Assoc. Editor: Yi-Shao Lai. 13 04 2017 08 07 2017 3D packaging MCM SOC...
Topics: Wire, Deflection
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011001.
Paper No: EP-16-1073
Published Online: November 10, 2016
... . Manuscript received June 14, 2016; final manuscript received October 25, 2016; published online November 10, 2016. Assoc. Editor: Mehdi Asheghi. 14 06 2016 25 10 2016 Chip stacking Failure analysis Harsh environment Micro vias SOC Thermal analysis Gallium nitride (GaN) based...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041004.
Paper No: EP-16-1089
Published Online: October 6, 2016
... Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received July 25, 2016; final manuscript received September 15, 2016; published online October 6, 2016. Assoc. Editor: Kaushik Mysore. 25 07 2016 15 09 2016 Electronic SOC Thermal...