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Journal Articles

Solders and Soldering

Howard H. Manko,, Author, Anthony J. Rafanelli,, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 2002, 124(3): 314.
https://doi.org/10.1115/1.1503063
Published Online: July 26, 2002
View Article titled, Solders and Soldering
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Topics: Soldering, Solders, Alloys, Materials properties
Journal Articles

Coatings Technology Handbook, Second Edition

D. Satas,, Editor,, Arthur A. Tracton,, Editor, and, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2002, 124(1): 67–68.
https://doi.org/10.1115/1.1446069
Published Online: March 1, 2002
View Article titled, Coatings Technology Handbook, Second Edition
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Topics: Coatings, Testing
Journal Articles

Mechanics of Materials and Interfaces: The Disturbed State Concept

Chandrakant S. Desai,, Author, Antonio Gens,, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. December 2001, 123(4): 406.
https://doi.org/10.1115/1.1416148
Published Online: December 1, 2001
View Article titled, Mechanics of Materials and Interfaces: The Disturbed State Concept
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Topics: Civil engineering, Interface phenomena, Strength (Materials)
Journal Articles

Industrial Electonics: Devices and Systems, Second Edition

Dale R. Patrick, Stephen W. Fardo, Anthony J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 2001, 123(3): 319.
https://doi.org/10.1115/1.1387243
Published Online: September 1, 2001
View Article titled, Industrial Electonics: Devices and Systems, Second Edition
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Topics: Engineers, Transistors, Computers, Junctions, Electronics, Electronics engineers, Energy resources, Gates (Closures), Generators, Mechanical engineering
Journal Articles

Handbook of Electronic Package Design

Michael Pecht,, Editor, Anthony J. Rafanelli,, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 2000, 122(2): 178–179.
https://doi.org/10.1115/1.483153
Published Online: June 1, 2000
View Article titled, Handbook of Electronic Package Design
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Topics: Design, Electronic packages, Thermal management, Printed circuit boards, Packaging
Journal Articles

Reliability of Photonics Materials and Structures (Proceedings of the Reliability of Photonics Materials and Structures Symposium held April 13–16, 1998 in San Francisco, CA)

Ephraim Suhir, Editor, Mitsuo Fukuda, Editor, Charles R. Kurkjian, Editor, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 1999, 121(1): 55.
https://doi.org/10.1115/1.2792662
Published Online: March 1, 1999
View Article titled, Reliability of Photonics Materials and Structures (Proceedings of the Reliability of Photonics Materials and Structures Symposium held April 13–16, 1998 in San Francisco, CA)
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Topics: Photonics, Reliability
Journal Articles

Hot Air Rises and Heat Sinks: Everything You Know About Cooling Electronics is Wrong

Tony Kordyban, Author, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. December 1998, 120(4): 395.
https://doi.org/10.1115/1.2792653
Published Online: December 1, 1998
View Article titled, Hot Air Rises and Heat Sinks: Everything You Know About Cooling Electronics is Wrong
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Topics: Cooling, Electronics, Heat sinks
Journal Articles

Printed Circuits Handbook, Fourth Edition

Clyde F. Coombs, Author, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 1998, 120(2): 213–214.
https://doi.org/10.1115/1.2792624
Published Online: June 1, 1998
View Article titled, Printed Circuits Handbook, Fourth Edition
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Topics: Circuits
Journal Articles

Quality Conformance and Qualification of Microelectronic Packages and Interconnects

Michael Pecht, Editor, Abhijit Dasgupta, Editor, John W. Evans, Editor, Jillian Y. Evans, Editor, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 1997, 119(1): 78.
https://doi.org/10.1115/1.2792205
Published Online: March 1, 1997
View Article titled, Quality Conformance and Qualification of Microelectronic Packages and Interconnects
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Journal Articles

Product Reliability, Maintainability, and Supportability Handbook

Michael Pecht, Editor, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 1996, 118(3): 188–189.
https://doi.org/10.1115/1.2792151
Published Online: September 1, 1996
View Article titled, Product Reliability, Maintainability, and Supportability Handbook
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Topics: Maintainability, Product reliability
Journal Articles

Chip on Board: Technologies for Multichip Modules

John H. Lau, Editor, Richard J. Prosman, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 1995, 117(2): 165.
https://doi.org/10.1115/1.2792085
Published Online: June 1, 1995
View Article titled, Chip on Board: Technologies for Multichip Modules
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Topics: Multi-chip modules