1-14 of 14
Waves
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate

Accepted Manuscript
Pan Ren, Chulin Wang, Yaya Liang, Xuan Zhao, Xiaojie Li, DU Pingan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-24-1071
https://doi.org/10.1115/1.4067269
Published Online: November 27, 2024
View Article titled, Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate
Open the PDF for Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate in another window
Topics: Ceramics, Circuits, Modeling, Signals, Three-dimensional models, Waves, Capacitance, Computational methods, Skin effect
Journal Articles

Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics

Reece Whitt, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041104.
Paper No: EP-24-1025
https://doi.org/10.1115/1.4065944
Published Online: July 25, 2024
View Article titled, Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics
Open the PDF for Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics in another window
Topics: Electronics, Flow (Dynamics), Heat transfer, Junctions, Nozzles, Temperature, Temperature control, Testing, Transients (Dynamics), Actuators
Journal Articles

Acoustic Characterization of Integrated Circuits During Operation

Josef Frankhouse, Changgen Li, Han Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041103.
Paper No: EP-24-1036
https://doi.org/10.1115/1.4065649
Published Online: June 20, 2024
View Article titled, Acoustic Characterization of Integrated Circuits During Operation
Open the PDF for Acoustic Characterization of Integrated Circuits During Operation in another window
Topics: Acoustic emissions, Acoustics, Electronics, Integrated circuits, Signals, Stress, Waves, Sensors, Monitoring systems
Journal Articles

Numerical Modeling of the Wave Soldering Process and Experimental Validation

Violeta Carvalho, Bruno Arcipreste, Delfim Soares, Luís Ribas, Nelson Rodrigues, Senhorinha F. C. F. Teixeira, José Carlos Teixeira
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011011.
Paper No: EP-21-1002
https://doi.org/10.1115/1.4050981
Published Online: August 6, 2021
View Article titled, Numerical Modeling of the Wave Soldering Process and Experimental Validation
Open the PDF for Numerical Modeling of the Wave Soldering Process and Experimental Validation in another window
Topics: Computer simulation, Soldering, Solders, Wave soldering, Waves, Strain measurement, Fluids
Journal Articles

Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation

Guoyi Li, Hyunseong Lee, Aditi Chattopadhyay, Rajesh Kumar Neerukatti, Kuang C. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011002.
Paper No: EP-19-1077
https://doi.org/10.1115/1.4047228
Published Online: June 4, 2020
View Article titled, Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation
Open the PDF for Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation in another window
Topics: Delamination, Inspection, Sealants, Signals, Waves, Nondestructive evaluation, Excitation, Integrated circuits
Journal Articles

Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves

Ken-ichi Ohguchi, Katsuhiko Sasaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041010.
https://doi.org/10.1115/1.4002911
Published Online: December 3, 2010
View Article titled, Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves
Open the PDF for Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves in another window
Topics: Creep, Lead-free solders, Fatigue life, Compression, Fatigue testing, Waves, Stress
Journal Articles

Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves

Ken-ichi Ohguchi, Katsuhiko Sasaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041003.
https://doi.org/10.1115/1.4002897
Published Online: November 23, 2010
View Article titled, Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves
Open the PDF for Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves in another window
Topics: Creep, Deformation, Lead-free solders, Stress, Waves, Solders, Alloys
Journal Articles

Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test

Ken-ichi Ohguchi, Katsuhiko Sasaki, Setsuo Aso
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021003.
https://doi.org/10.1115/1.3103951
Published Online: March 27, 2009
View Article titled, Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test
Open the PDF for Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test in another window
Topics: Creep, Lead-free solders, Stress, Stress-strain relations, Deformation, Waves, Solders, Simulation, Constitutive equations, Alloys
Journal Articles

On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials

Yoonchan Oh, C. Steve Suh, Hung-Jue Sue
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021009.
https://doi.org/10.1115/1.2912209
Published Online: May 9, 2008
View Article titled, On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials
Open the PDF for On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials in another window
Topics: Damage, Epoxy resins, Failure mechanisms, Flip-chip, Flip-chip devices, Reliability, Solder joints, Solders, Viscoelasticity, Waves
Journal Articles

On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion

Yoonchan Oh, C. Steve Suh, Hung-Jue Sue
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021008.
https://doi.org/10.1115/1.2912188
Published Online: May 9, 2008
View Article titled, On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion
Open the PDF for On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion in another window
Topics: Damage, Failure, Failure mechanisms, Flip-chip devices, High cycle fatigue, Power density, Solders, Stress, Thermal expansion, Wave motion
Journal Articles

A Strain Rate Ratio Approach for Assessing Creep-Fatigue Life of 63Sn-37Pb Solder Under Shear Loading

Yutaka Tsukada, Hideo Nishimura, Hiroki Yamamoto, Masao Sakane
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 407–414.
https://doi.org/10.1115/1.2070091
Published Online: December 24, 2004
View Article titled, A Strain Rate Ratio Approach for Assessing Creep-Fatigue Life of 63Sn-37Pb Solder Under Shear Loading
Open the PDF for A Strain Rate Ratio Approach for Assessing Creep-Fatigue Life of 63Sn-37Pb Solder Under Shear Loading in another window
Topics: Creep, Fatigue, Solders, Fatigue life, Damage, Shear (Mechanics), Waves, Ductility
Journal Articles

Non-Fourier Heat Conduction in IC Chip

Zeng-Yuan Guo, Yun-Sheng Xu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 174–177.
https://doi.org/10.1115/1.2792088
Published Online: September 1, 1995
View Article titled, Non-Fourier Heat Conduction in IC Chip
Open the PDF for Non-Fourier Heat Conduction in IC Chip in another window
Topics: Diffusion (Physics), Heat conduction, Noise (Sound), Reliability, Temperature, Thermal stresses, Transient heat transfer, Waves
Journal Articles

The Influence of the Cycle Frequency and Wave Shape on the Fatigue Life of Leaded Chip Carrier Printed Wiring Board Interconnections

H. D. Solomon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 173–179.
https://doi.org/10.1115/1.2909314
Published Online: June 1, 1993
View Article titled, The Influence of the Cycle Frequency and Wave Shape on the Fatigue Life of Leaded Chip Carrier Printed Wiring Board Interconnections
Open the PDF for The Influence of the Cycle Frequency and Wave Shape on the Fatigue Life of Leaded Chip Carrier Printed Wiring Board Interconnections in another window
Topics: Cycles, Fatigue life, Printed circuit boards, Shapes, Waves, Displacement, Fatigue, Solder joints
Journal Articles

A Study of Forces and Motion Generated During Pulsed Laser Welding of Optical Packages

S. Rangwala
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 343–349.
https://doi.org/10.1115/1.2905418
Published Online: December 1, 1991
View Article titled, A Study of Forces and Motion Generated During Pulsed Laser Welding of Optical Packages
Open the PDF for A Study of Forces and Motion Generated During Pulsed Laser Welding of Optical Packages in another window
Topics: Laser welding, Lasers, Cooling, Dynamics (Mechanics), Laser beams, Manufacturing, Shrinkage (Materials), Thermal stresses, Waves, Welding