1-20 of 24
Tension
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints

Whit Vinson, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011007.
Paper No: EP-24-1056
https://doi.org/10.1115/1.4066014
Published Online: August 9, 2024
View Article titled, Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints
Open the PDF for Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints in another window
Topics: Current density, Electrodiffusion, Failure, Solder joints, Solders, Stress, Temperature, Tension, Testing, Electrons
Journal Articles

Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics

Behnam Garakani, Udara S. Somarathna, Ashraf Umar, Gurvinder Singh Khinda, Mohamed Youssef M. Abdelatty, El Mehdi Abbara, Sari Al Zerey, Mike Hopkins, Sai Srinivas, Chuck Kinzel, Christopher Halseth, Mark Ronay, Mark D. Poliks
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031006.
Paper No: EP-22-1008
https://doi.org/10.1115/1.4056640
Published Online: February 1, 2023
View Article titled, Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics
Open the PDF for Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics in another window
Topics: Fatigue, Liquid metals, Tension, Transmission lines, Cycles, Fatigue testing, Reliability, Wearable devices, Metals, Simulation
Journal Articles

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Mahsa Montazeri, Whit M. Vinson, David R. Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021002.
Paper No: EP-22-1037
https://doi.org/10.1115/1.4055024
Published Online: August 8, 2022
View Article titled, Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions
Open the PDF for Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions in another window
Topics: Electrodiffusion, Failure, Solder joints, Solders, Stress, Temperature, Tension, Testing, Current density, Tin
Journal Articles

Mechanical Testing for Stretchable Electronics

Steven A. Klein, Aleksandar Aleksov, Vijay Subramanian, Pramod Malatkar, Ravi Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020905.
Paper No: EP-16-1147
https://doi.org/10.1115/1.4036389
Published Online: April 28, 2017
View Article titled, Mechanical Testing for Stretchable Electronics
Open the PDF for Mechanical Testing for Stretchable Electronics in another window
Topics: Electronics, Failure, Mechanical testing, Testing, Tension, Membranes, Reliability, Cycles
Journal Articles

Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer

M. A. Neidigk, Y.-L. Shen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011003.
https://doi.org/10.1115/1.3068298
Published Online: February 11, 2009
View Article titled, Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer
Open the PDF for Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer in another window
Topics: Ceramics, Coating processes, Coatings, Computer simulation, Cooling, Epoxy resins, Failure, Ferrites (Magnetic materials), Finite element analysis, Manufacturing
Journal Articles

Failure Analysis of Miniature Solder Specimen

Y. Wei, C. L. Chow, H. E. Fang, M. K. Neilsen, T. J. Lim, W. Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 100–105.
https://doi.org/10.1115/1.1648060
Published Online: April 30, 2004
View Article titled, Failure Analysis of Miniature Solder Specimen
Open the PDF for Failure Analysis of Miniature Solder Specimen in another window
Topics: Damage, Failure analysis, Finite element analysis, Solders, Creep, Fatigue, Constitutive equations, Nonequilibrium thermodynamics, Stress, Displacement
Journal Articles

Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages

Michael C. Larson, Mem. ASME, Melody A. Verges, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 18–23.
https://doi.org/10.1115/1.1520430
Published Online: March 14, 2003
View Article titled, Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages
Open the PDF for Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages in another window
Topics: Compression, Die cutting, Fatigue cracks, Fatigue life, Fracture (Materials), Printed circuit boards, Shear (Mechanics), Shearing (Deformation), Solders, Stress
Journal Articles

Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys—Experiments and Constitutive Modeling

Katsuhiko Sasaki, Associate Professor,, Ken-ichi Ohguchi, Research Associate,, Hiromasa Ishikawa, Mem. ASME, Professor,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 379–387.
https://doi.org/10.1115/1.1371927
Published Online: August 24, 1999
View Article titled, Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys—Experiments and Constitutive Modeling
Open the PDF for Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys—Experiments and Constitutive Modeling in another window
Topics: Alloys, Compression, Constitutive equations, Creep, Deformation, Simulation, Solders, Stress, Temperature, Tension
Journal Articles

Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications

N. R. Sottos, J. M. Ockers, M. Swindeman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 37–43.
https://doi.org/10.1115/1.2792659
Published Online: March 1, 1999
View Article titled, Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications
Open the PDF for Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications in another window
Topics: Composite materials, Printed circuit boards, Thermoelasticity, Textiles, Geometry, Lumber, Elastic moduli, Epoxy adhesives, Epoxy resins, Fibers
Journal Articles

Characterizing the Failure Envelope of a Conductive Adhesive

D. Olliff, J. Qu, M. Gaynes, R. Kodnani, A. Zubelewicz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 23–30.
https://doi.org/10.1115/1.2792657
Published Online: March 1, 1999
View Article titled, Characterizing the Failure Envelope of a Conductive Adhesive
Open the PDF for Characterizing the Failure Envelope of a Conductive Adhesive in another window
Topics: Adhesives, Failure, Shear (Mechanics), Coulombs, Tension, Bonding, Compression, Copper, Finite element model, Mechanical testing
Journal Articles

Towards an Integrated Approach for Analysis and Design of Wafer Slicing by a Wire Saw

R. K. Sahoo, V. Prasad, I. Kao, J. Talbott, K. P. Gupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 35–40.
https://doi.org/10.1115/1.2792283
Published Online: March 1, 1998
View Article titled, Towards an Integrated Approach for Analysis and Design of Wafer Slicing by a Wire Saw
Open the PDF for Towards an Integrated Approach for Analysis and Design of Wafer Slicing by a Wire Saw in another window
Topics: Design, Semiconductor wafers, Wire, Cutting, Algorithms, Feedback, Finishes, Finite element methods, Fracture (Materials), Fracture (Process)
Journal Articles

Thermomechanical Mechanism for Delamination of Polymer Coatings From Optical Fibers

W. W. King, C. J. Aloisio, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 133–137.
https://doi.org/10.1115/1.2792219
Published Online: June 1, 1997
View Article titled, Thermomechanical Mechanism for Delamination of Polymer Coatings From Optical Fibers
Open the PDF for Thermomechanical Mechanism for Delamination of Polymer Coatings From Optical Fibers in another window
Topics: Coatings, Delamination, Optical fiber, Polymers, Thermomechanics, Tension, Fibers, Compressive stress, Composite materials, Hydrostatics
Journal Articles

A Model Study of Thermal Stress-Induced Voiding in Electronic Packages

Y. Huang, K. X. Hu, C. P. Yeh, N.-Y. Li, K. C. Hwang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 229–234.
https://doi.org/10.1115/1.2792157
Published Online: December 1, 1996
View Article titled, A Model Study of Thermal Stress-Induced Voiding in Electronic Packages
Open the PDF for A Model Study of Thermal Stress-Induced Voiding in Electronic Packages in another window
Topics: Electronic packages, Stress, Cavitation, Solids, Adhesives, Design, Failure mechanisms, Hardening, Hydrostatics, Integrated circuits
Journal Articles

Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity

Hiromasa Ishikawa, Katsuhiko Sasaki, Ken-ichi Ohguchi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 164–169.
https://doi.org/10.1115/1.2792147
Published Online: September 1, 1996
View Article titled, Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity
Open the PDF for Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity in another window
Topics: Constitutive equations, Fatigue failure, Solders, Viscoplasticity, Alloys, Deformation, Density, Compression, Creep, Fatigue life
Journal Articles

A Fractional-Factorial Numerical Technique for Stress Analysis of Glass-To-Metal Lead Seals

Barry Mathieu, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 98–104.
https://doi.org/10.1115/1.2905512
Published Online: June 1, 1994
View Article titled, A Fractional-Factorial Numerical Technique for Stress Analysis of Glass-To-Metal Lead Seals
Open the PDF for A Fractional-Factorial Numerical Technique for Stress Analysis of Glass-To-Metal Lead Seals in another window
Topics: Glass, Metals, Stress analysis (Engineering), Stress, Design, Experimental design, Fracture (Materials), Fracture (Process), Geometry, Simulation
Journal Articles

Finding the Constitutive Relation for a Specific Elastomer

Yun Ling, Peter A. Engel, Wm. L. Brodskey, Yifan Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 329–336.
https://doi.org/10.1115/1.2909336
Published Online: September 1, 1993
View Article titled, Finding the Constitutive Relation for a Specific Elastomer
Open the PDF for Finding the Constitutive Relation for a Specific Elastomer in another window
Topics: Elastomers, Compression, Deflection, Deformation, Finite element analysis, Natural rubber, Polynomials, Shear (Mechanics), Springs, Stress
Journal Articles

Debonding in Overmolded Integrated Circuit Packages

S. Hunt, L. A. Carlsson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 249–255.
https://doi.org/10.1115/1.2909325
Published Online: September 1, 1993
View Article titled, Debonding in Overmolded Integrated Circuit Packages
Open the PDF for Debonding in Overmolded Integrated Circuit Packages in another window
Topics: Analytical methods, Bond strength, Electronic packages, Failure, Finite element analysis, Integrated circuits, Printed circuit boards, Shear (Mechanics), Stress, Stress analysis (Engineering)
Journal Articles

Analytical Solutions of Stresses in a Cylindrical Plate Due to Polynomial Radial Temperature Distributions

Frank F. H. Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 214–218.
https://doi.org/10.1115/1.2909320
Published Online: June 1, 1993
View Article titled, Analytical Solutions of Stresses in a Cylindrical Plate Due to Polynomial Radial Temperature Distributions
Open the PDF for Analytical Solutions of Stresses in a Cylindrical Plate Due to Polynomial Radial Temperature Distributions in another window
Topics: Polynomials, Stress, Temperature distribution, Heating, Failure, Fracture (Process), Manufacturing, Temperature, Thermal expansion, Thermal stresses
Journal Articles

Thermal Stress Analysis of Pin Grid Array Structures: Pin and Solder Joint Problems

Peter A. Engel, Kee Rong Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 314–321.
https://doi.org/10.1115/1.2905457
Published Online: September 1, 1992
View Article titled, Thermal Stress Analysis of Pin Grid Array Structures: Pin and Solder Joint Problems
Open the PDF for Thermal Stress Analysis of Pin Grid Array Structures: Pin and Solder Joint Problems in another window
Topics: Solder joints, Thermal stresses, Stress, Cross section (Physics), Failure mechanisms, Finite element methods, Iterative methods, Plasticity, Pressure, Solders
Journal Articles

Deformation and Fracture of Pb-Sn-Eutectic Under Tensile and Fatigue Loading

S.-M. Lee, D. S. Stone
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 118–121.
https://doi.org/10.1115/1.2906407
Published Online: June 1, 1992
View Article titled, Deformation and Fracture of Pb-Sn-Eutectic Under Tensile and Fatigue Loading
Open the PDF for Deformation and Fracture of Pb-Sn-Eutectic Under Tensile and Fatigue Loading in another window
Topics: Deformation, Fatigue, Fracture (Materials), Tin, Failure, Cavitation, Displacement, Fatigue testing, Grain boundaries, Compression