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Journal Articles

Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges

Y. W. Wang, M. Y. Tsai, Y. S. Chou

Publisher: ASME

J. Electron. Packag. September 2024, 146(3): 031001.

Paper No: EP-23-1070

https://doi.org/10.1115/1.4064354

Published Online: January 8, 2024

View Article titled, Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges

Topics: Finite element methods, Flip-chip packages, Gages, Strain gages, Warping

Journal Articles

Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package

Fei Chong Ng, Mohamad Aizat Abas

Publisher: ASME

J. Electron. Packag. December 2022, 144(4): 041009.

Paper No: EP-21-1137

https://doi.org/10.1115/1.4052920

Published Online: December 1, 2021

View Article titled, Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package

Topics: Design, Flip-chip packages, Flow (Dynamics), Optimization, Fluids, Computer simulation

Journal Articles

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Xingjun Yao, Weijie Jiang, Jiahui Yang, Junjie Fang, Wenjun Zhang

Publisher: ASME

J. Electron. Packag. December 2022, 144(4): 041003.

Paper No: EP-20-1094

https://doi.org/10.1115/1.4052275

Published Online: November 22, 2021

View Article titled, A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Topics: Computational fluid dynamics, Flip-chip, Flip-chip packages, Flow (Dynamics), Simulation, Solders, Surface energy, Uncertainty, Shapes, Packaging

Journal Articles

Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability

Satoru Katsurayama, Hironori Tohmyoh

Publisher: ASME

J. Electron. Packag. September 2009, 131(3): 031005.

https://doi.org/10.1115/1.3144153

Published Online: June 23, 2009

View Article titled, Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability

Topics: Flip-chip packages, Hardening (Curing), Manufacturing, Reliability, Temperature, Warping, Flow (Dynamics), Flip-chip devices

Journal Articles

Underfill Filler Settling Effect on the Die Backside Interfacial Stresses of Flip Chip Packages

Cheng-fu Chen, Pramod C. Karulkar

Publisher: ASME

J. Electron. Packag. September 2008, 130(3): 031005.

https://doi.org/10.1115/1.2957324

Published Online: July 30, 2008

View Article titled, Underfill Filler Settling Effect on the Die Backside Interfacial Stresses of Flip Chip Packages

Topics: Fillers (Materials), Stress, Particulate matter, Flip-chip packages, Flip-chip devices

Journal Articles

A Theoretical Analysis of the Concept of Critical Clearance Toward a Design Methodology for the Flip-Chip Package

J. W. Wan, W. J. Zhang, D. J. Bergstrom

Publisher: ASME

J. Electron. Packag. December 2007, 129(4): 473–478.

https://doi.org/10.1115/1.2804098

Published Online: March 13, 2007

View Article titled, A Theoretical Analysis of the Concept of Critical Clearance Toward a Design Methodology for the Flip-Chip Package

Topics: Clearances (Engineering), Flip-chip packages, Solders, Design

Journal Articles

Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling

Woon-Seong Kwon, Hyoung-Joon Kim, Kyung-Wook Paik, Se-Young Jang, Soon-Min Hong

Publisher: ASME

J. Electron. Packag. June 2004, 126(2): 202–207.

https://doi.org/10.1115/1.1756143

Published Online: July 8, 2004

View Article titled, Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling

Topics: Adhesion, Aluminum, Cycles, Damage, Delamination, Dielectric materials, Displacement, Flip-chip packages, Fracture (Materials), Fracture (Process)

Journal Articles

Analysis of Interfacial Cracking in Flip Chip Packages With Viscoplastic Solder Deformation

M. J. Heffes, H. F. Nied

Publisher: ASME

J. Electron. Packag. March 2004, 126(1): 135–141.

https://doi.org/10.1115/1.1649242

Published Online: April 30, 2004

View Article titled, Analysis of Interfacial Cracking in Flip Chip Packages With Viscoplastic Solder Deformation

Topics: Deformation, Flip-chip, Flip-chip devices, Fracture (Materials), Solders, Stress, Fracture (Process), Flip-chip packages

Journal Articles

Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies

Xia Cai, Liu Chen, Qun Zhang, Bulu Xu, Weidong Huang, Xiaoming Xie, Zhaonian Cheng

Publisher: ASME

J. Electron. Packag. March 2003, 125(1): 84–92.

https://doi.org/10.1115/1.1533802

Published Online: March 14, 2003

View Article titled, Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies

Topics: Finite element analysis, Flip-chip assemblies, Simulation, Solder joints, Solders, Stress, Deformation, Cycles, Flip-chip packages, Thermal expansion

Journal Articles

Measurement of Thermal Deformation of Interconnect Layers Using SIEM

Sheng Chang and, Fu-Pen Chiang, Yifan Guo

Publisher: ASME

J. Electron. Packag. September 2002, 124(3): 310–313.

https://doi.org/10.1115/1.1481367

Published Online: July 26, 2002

View Article titled, Measurement of Thermal Deformation of Interconnect Layers Using SIEM

Topics: Deformation, Dielectric materials, Displacement, Electron microscopy, Interferometry, Packaging, Reliability, Resolution (Optics), Thermal deformation, Thermal expansion

Journal Articles

Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages

K. N. Chiang, Associate Professor, C. W. Chang, Graduate Student, C. T. Lin, Graduate Student

Publisher: ASME

J. Electron. Packag. December 2001, 123(4): 331–337.

https://doi.org/10.1115/1.1389847

Published Online: May 10, 2001

View Article titled, Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages

Topics: Adhesives, Finite element analysis, Flip-chip devices, Manufacturing, Modeling, Particulate matter, Pressure, Springs, Mechanical behavior, Flip-chip packages

Journal Articles

Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages

A. Q. Xu, H. F. Nied

Publisher: ASME

J. Electron. Packag. December 2000, 122(4): 301–305.

https://doi.org/10.1115/1.1289768

Published Online: December 1, 2000

View Article titled, Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages

Topics: Corners (Structural elements), Delamination, Epoxy adhesives, Epoxy resins, Finite element analysis, Fracture (Materials), Silicon, Stress, Stress singularity, Geometry

Journal Articles

Interfacial Delamination Near Solder Bumps and UBM in Flip-Chip Packages

Yu Gu, Toshio Nakamura, Mem. ASME, William T. Chen, Brian Cotterell

Publisher: ASME

J. Electron. Packag. September 2001, 123(3): 295–301.

https://doi.org/10.1115/1.1348338

Published Online: August 1, 2000

View Article titled, Interfacial Delamination Near Solder Bumps and UBM in Flip-Chip Packages

Topics: Delamination, Fracture (Materials), Solders, Stress, Fracture (Process), Flip-chip packages, Finite element analysis

Journal Articles

Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study

B. Han, Mem. ASME, P. Kunthong

Publisher: ASME

J. Electron. Packag. December 2000, 122(4): 294–300.

https://doi.org/10.1115/1.1290000

Published Online: May 15, 2000

View Article titled, Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study

Topics: Circuits, Deformation, Displacement, Flip-chip devices, Flip-chip packages, Interferometry, Flip-chip assemblies, Metals, Shear deformation, Reliability

Journal Articles

Thermal and Mechanical Loading Effects on the Reliability of Organic Flip Chip Package

Teck Joo Goh

Publisher: ASME

J. Electron. Packag. March 2001, 123(1): 83–87.

https://doi.org/10.1115/1.1289999

Published Online: April 10, 2000

View Article titled, Thermal and Mechanical Loading Effects on the Reliability of Organic Flip Chip Package

Topics: Design, Finite element analysis, Finite element model, Flip-chip, Flip-chip devices, Flip-chip packages, Heat sinks, Reliability, Stress, Silicon

Journal Articles

An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling

Yong Du, Jie-Hua Zhao, Paul Ho

Publisher: ASME

J. Electron. Packag. September 2001, 123(3): 196–199.

https://doi.org/10.1115/1.1347987

Published Online: March 21, 2000

View Article titled, An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling

Topics: Electronic packages, Finite element analysis, Laser beams, Temperature, Flip-chip packages, Warping, Thermal expansion, Deformation, Lasers, Packaging

Journal Articles

Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages

Q. Yao, J. Qu

Publisher: ASME

J. Electron. Packag. September 1999, 121(3): 196–201.

https://doi.org/10.1115/1.2792684

Published Online: September 1, 1999

View Article titled, Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages

Topics: Finite element analysis, Flip-chip packages, Modeling, Deflection, Flip-chip assemblies, Printed circuit boards, Stress, Design, Multi-chip modules, Size effect

Journal Articles

Reliability of Underfill-Encapsulated Flip-Chips With Heat Spreaders

H. Doi, K. Kawano, A. Yasukawa, T. Sato

Publisher: ASME

J. Electron. Packag. December 1998, 120(4): 322–327.

https://doi.org/10.1115/1.2792641

Published Online: December 1, 1998

View Article titled, Reliability of Underfill-Encapsulated Flip-Chips With Heat Spreaders

Topics: Flat heat pipes, Flip-chip devices, Reliability, Solder joints, Delamination, Failure mechanisms, Fatigue life, Flip-chip packages, Mechanical properties, Shapes

Journal Articles

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

E. Madenci, S. Shkarayev, R. Mahajan

Publisher: ASME

J. Electron. Packag. December 1998, 120(4): 336–341.

https://doi.org/10.1115/1.2792643

Published Online: December 1, 1998

View Article titled, Potential Failure Sites in a Flip-Chip Package With and Without Underfill

Topics: Failure, Flip-chip packages, Stress, Density, Finite element analysis

Journal Articles

Process Induced Stresses of a Flip-Chip Packaging by Sequential Processing Modeling Technique

J. Wang, Z. Qian, S. Liu

Publisher: ASME

J. Electron. Packag. September 1998, 120(3): 309–313.

https://doi.org/10.1115/1.2792638

Published Online: September 1, 1998

View Article titled, Process Induced Stresses of a Flip-Chip Packaging by Sequential Processing Modeling Technique

Topics: Flip-chip, Modeling, Packaging, Stress, Manufacturing, Deflection, Finite element analysis, Warping, Alloys, Bonding

Journal citation

NARROW

Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges

Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability

Underfill Filler Settling Effect on the Die Backside Interfacial Stresses of Flip Chip Packages

A Theoretical Analysis of the Concept of Critical Clearance Toward a Design Methodology for the Flip-Chip Package

Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling

Analysis of Interfacial Cracking in Flip Chip Packages With Viscoplastic Solder Deformation

Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies

Measurement of Thermal Deformation of Interconnect Layers Using SIEM

Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages

Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages

Interfacial Delamination Near Solder Bumps and UBM in Flip-Chip Packages

Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study

Thermal and Mechanical Loading Effects on the Reliability of Organic Flip Chip Package

An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling

Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages

Reliability of Underfill-Encapsulated Flip-Chips With Heat Spreaders

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

Process Induced Stresses of a Flip-Chip Packaging by Sequential Processing Modeling Technique

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