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Journal Articles

Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements

Pradeep Lall, Tony Thomas, Vikas Yadav, Jinesh Narangaparambil, Wei Liu

J. Electron. Packag. December 2020, 142(4): 041113.

Paper No: EP-20-1037

DOI: https://doi.org/10.1115/1.4047579

Published Online: July 10, 2020

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Topics: Cycles, Failure, Flexible electronics, Modeling, Reliability, Electronics, Regression models, Failure analysis

Journal Articles

Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki

J. Electron. Packag. September 2020, 142(3): 031107.

Paper No: EP-19-1129

DOI: https://doi.org/10.1115/1.4046849

Published Online: April 24, 2020

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Topics: Circuits, Damage, Electrodiffusion, Failure analysis, Flexible electronics, Inks, Metals, Nanoparticles, Reliability, Density

Journal Articles

Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking

Quang T. Su, Mohammad A. Gharaibeh, Aaron J. Stewart, James M. Pitarresi, Martin K. Anselm

J. Electron. Packag. December 2018, 140(4): 041004.

Paper No: EP-17-1062

DOI: https://doi.org/10.1115/1.4040923

Published Online: August 20, 2018

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Topics: Deflection, Failure, Failure analysis, Finite element analysis, Finite element model, Manufacturing, Reliability, Resonance, Solder joints, Solders

Journal Articles

Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek

J. Electron. Packag. March 2018, 140(1): 010903.

Paper No: EP-17-1090

DOI: https://doi.org/10.1115/1.4039333

Published Online: March 2, 2018

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Topics: Electronics, Failure, Reliability, Stress, Temperature, Failure mechanisms, Cycles, Safety, Failure analysis, Simulation

Journal Articles

Special Section on IMECE 2016

Justin A. Weibel, S. Ravi Annapragada

J. Electron. Packag. June 2017, 139(2): 020301.

Paper No: EP-17-1032

DOI: https://doi.org/10.1115/1.4036627

Published Online: June 12, 2017

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Topics: Failure analysis, Flexible electronics, Packaging, Reliability, Semiconductor wafers, Solders, Thermal analysis, Electronic packaging

Journal Articles

Reviewers Acknowledgment for the Journal of Electronic Packaging

J. Electron. Packag. September 2016, 138(3): 038001.

Paper No: EP-16-1065

DOI: https://doi.org/10.1115/1.4033688

Published Online: June 6, 2016

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Topics: Density, Electronic packaging, Failure analysis, Packaging

Journal Articles

Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling

Da Yu, Hohyung Lee, Seungbae Park

J. Electron. Packag. December 2012, 134(4): 041008.

DOI: https://doi.org/10.1115/1.4007674

Published Online: November 16, 2012

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Topics: Cycles, Failure, Fracture (Materials), Reliability, Solder joints, Failure mechanisms, Stress, Failure analysis

Journal Articles

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

Hung-Jen Chang, Chau-Jie Zhan, Tao-Chih Chang, Jung-Hua Chou

J. Electron. Packag. March 2012, 134(1): 011011.

DOI: https://doi.org/10.1115/1.4005956

Published Online: March 19, 2012

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Topics: Failure, Failure analysis, Fracture (Materials), Intermetallic compounds, Lead-free solders, Printed circuit board assemblies, Solder joints, Solders, Stress, Tin

Journal Articles

Behavior of Lead-Free Solder Under Thermomechanical Loading

Y. Wei, C. L. Chow, K. J. Lau, P. Vianco, H. E. Fang

J. Electron. Packag. September 2004, 126(3): 367–373.

DOI: https://doi.org/10.1115/1.1773197

Published Online: October 6, 2004

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Topics: Constitutive equations, Damage, Deformation, Finite element analysis, Lead-free solders, Solders, Stress, Temperature, Thermomechanics, Alloys

Journal Articles

Failure Analysis of Miniature Solder Specimen

Y. Wei, C. L. Chow, H. E. Fang, M. K. Neilsen, T. J. Lim, W. Lu

J. Electron. Packag. March 2004, 126(1): 100–105.

DOI: https://doi.org/10.1115/1.1648060

Published Online: April 30, 2004

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Topics: Damage, Failure analysis, Finite element analysis, Solders, Creep, Fatigue, Constitutive equations, Nonequilibrium thermodynamics, Stress, Displacement

Journal Articles

Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems

L. J. Ernst, Guest Editor, G. Q. Zhang, Guest Editor

J. Electron. Packag. December 2003, 125(4): 465.

DOI: https://doi.org/10.1115/1.1634590

Published Online: December 15, 2003

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Topics: Engineering simulation, Microelectromechanical systems, Microelectronic devices, Optimization, Thermal management, Computer simulation, Failure analysis, Micromechanical devices, Packaging

Journal Articles

Failure Analysis of Full Delamination on the Stacked Die Leaded Packages

T. Y. Lin, Z. P. Xiong, Y. F. Yao, Lane Tok, Z. Y. Yu, Budi Njoman, K. H. Chua, Y. Y. Ma

J. Electron. Packag. September 2003, 125(3): 392–399.

DOI: https://doi.org/10.1115/1.1602704

Published Online: September 17, 2003

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Topics: Delamination, Finite element analysis, Stress concentration, Failure analysis, Adhesion

Journal Articles

Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications

Patricia F. Mead, Aravind Ramamoorthy, Shapna Pal

J. Electron. Packag. June 2003, 125(2): 294–301.

DOI: https://doi.org/10.1115/1.1571076

Published Online: June 10, 2003

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Topics: Failure, Failure analysis, Microwaves, Proton exchange membranes, Radiation (Physics), Stress, Delamination, Heating, Leakage, Electronic packaging

Journal Articles

Evaluation of Smear and Its Effect on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring Boards

R. Venkatraman, K. Ramakrishna, Mem. ASME, K. Knadle, W. T. Chen, Fellow ASME, G. C. Haddon

J. Electron. Packag. March 2001, 123(1): 6–15.

DOI: https://doi.org/10.1115/1.1326437

Published Online: July 1, 2000

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Topics: Copper, Double refraction, Drilling, Drills (Tools), Epoxy resins, Failure, Failure analysis, Finite element analysis, Fracture (Materials), Glass

Journal Articles

Lead-On-Chip Versus Chip-On-Lead Packages and Solder Failure Criteria

Boris Mirman

J. Electron. Packag. September 2000, 122(3): 279–280.

DOI: https://doi.org/10.1115/1.1286105

Published Online: January 9, 2000

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Topics: Failure, Reliability, Solders, Stress, Molding, Solder joints, Thermal stresses, Integrated circuits, Failure analysis, Integrated circuit packaging

Journal Articles

Failure Analysis of Liquid Crystal Displays Due to Indium Tin Oxide Breakdown

T. J. Dishoungh, M. Dube, M. Pecht, J. Wyler

J. Electron. Packag. June 1999, 121(2): 126–127.

DOI: https://doi.org/10.1115/1.2792667

Published Online: June 1, 1999

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Topics: Failure analysis, Liquid crystals

Journal Articles

Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM

Z. Q. Yu, Y. C. Chan, D. P. Webb, G. Y. Li

J. Electron. Packag. June 2000, 122(2): 172–177.

DOI: https://doi.org/10.1115/1.483151

Published Online: May 21, 1999

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Topics: Acoustics, Capacitors, Ceramics, Delamination, Nondestructive evaluation, Testing, Microscopy, Thermal shock, Reliability, Failure analysis

Journal Articles

A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints

Zequn Mei, Helen Holder

J. Electron. Packag. June 1996, 118(2): 62–66.

DOI: https://doi.org/10.1115/1.2792133

Published Online: June 1, 1996

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Topics: Fatigue failure, Solder joints, Tin, Coatings, Failure, Agglomeration (Materials), Atoms, Cycles, Failure analysis, Melting

Journal Articles

Integrated Infrared Failure Analysis of Printed Circuit Boards

J. J. Miles, C. R. Zelak, J. M. Kliman, J. E. Sunderland

J. Electron. Packag. December 1995, 117(4): 288–293.

DOI: https://doi.org/10.1115/1.2792107

Published Online: December 1, 1995

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Topics: Failure analysis, Printed circuit boards, Testing, Heat transfer, Infrared imaging, Manufacturing, Radiation (Physics)

Journal Articles

Reliability Issues in Plated-Through-Holes Due to Insertion-Mount Compliant-Pin Connectors

G. Ganguly, A. Dasgupta

J. Electron. Packag. June 1995, 117(2): 147–152.

DOI: https://doi.org/10.1115/1.2792082

Published Online: June 1, 1995

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Topics: Copper, Damage, Deformation, Failure analysis, Finite element analysis, Fourier series, Manufacturing, Materials properties, Pins (Engineering), Printed circuit boards

Journal citation

NARROW

Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements

Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink

Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking

Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Special Section on IMECE 2016

Reviewers Acknowledgment for the Journal of Electronic Packaging

Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

Behavior of Lead-Free Solder Under Thermomechanical Loading

Failure Analysis of Miniature Solder Specimen

Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems

Failure Analysis of Full Delamination on the Stacked Die Leaded Packages

Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications

Evaluation of Smear and Its Effect on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring Boards

Lead-On-Chip Versus Chip-On-Lead Packages and Solder Failure Criteria

Failure Analysis of Liquid Crystal Displays Due to Indium Tin Oxide Breakdown

Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM

A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints

Integrated Infrared Failure Analysis of Printed Circuit Boards

Reliability Issues in Plated-Through-Holes Due to Insertion-Mount Compliant-Pin Connectors

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