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Journal Articles

Optimization of a Thermoelectric Cooler for Time-Varying Heat Load and Sink Temperature

Matthew R. Pearson, Charles E. Lents

Publisher: ASME

J. Electron. Packag. December 2016, 138(4): 041010.

Paper No: EP-16-1012

https://doi.org/10.1115/1.4034861

Published Online: October 27, 2016

View Article titled, Optimization of a Thermoelectric Cooler for Time-Varying Heat Load and Sink Temperature

Topics: Heat, Stress, Temperature, Thermoelectric coolers, Thermal conductivity, Cycles, Electrical conductance

Journal Articles

Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink

Bengt Sundén, Gongnan Xie

Publisher: ASME

J. Electron. Packag. June 2014, 136(2): 024501.

Paper No: EP-13-1058

https://doi.org/10.1115/1.4026538

Published Online: April 29, 2014

View Article titled, Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink

Topics: Cooling, Heat, Heat sinks, Strips, Temperature, Thermal analysis, Thermal resistance, Electrical conductance, Invar, Temperature distribution

Journal Articles

An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials

B. Dan, B. G. Sammakia, G. Subbarayan, S. Kanuparthi

Publisher: ASME

J. Electron. Packag. September 2013, 135(3): 031003.

Paper No: EP-12-1098

https://doi.org/10.1115/1.4024392

Published Online: June 4, 2013

View Article titled, An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials

Topics: Particulate matter, Thermal conductivity, Electrical conductance, Network models, Approximation

Journal Articles

Lifetime Estimation of Moems Devices

T. Bar-Kohany, A. Stern

Publisher: ASME

J. Electron. Packag. June 2007, 129(2): 144–148.

https://doi.org/10.1115/1.2721085

Published Online: June 13, 2006

View Article titled, Lifetime Estimation of Moems Devices

Topics: Cavities, Flow (Dynamics), Leakage, Microoptoelectromechanical systems, Pressure, Water, Electrical conductance

Journal Articles

Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material

Zongrong Liu, D. D. L. Chung

Publisher: ASME

J. Electron. Packag. December 2006, 128(4): 319–323.

https://doi.org/10.1115/1.2351895

Published Online: June 1, 2006

View Article titled, Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material

Topics: Boron, Contact resistance, Paraffin wax, Particulate matter, Pressure, Temperature, Thermal conductivity, Electrical conductance, Copper

Journal Articles

Thermal Interfacing Techniques for Electronic Equipment—A Perspective

Wataru Nakayama, Arthur E. Bergles

Publisher: ASME

J. Electron. Packag. June 2003, 125(2): 192–199.

https://doi.org/10.1115/1.1568127

Published Online: June 10, 2003

View Article titled, Thermal Interfacing Techniques for Electronic Equipment—A Perspective

Topics: Contact resistance, Cooling, Electrical conductance, Electronic equipment, Flat heat pipes, Flow (Dynamics), Heat, Heat conduction, Heat sinks, Heat transfer

Journal Articles

Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

Xiangcheng Luo,, Yunsheng Xu, and, D. D. L. Chung

Publisher: ASME

J. Electron. Packag. September 2001, 123(3): 309–311.

https://doi.org/10.1115/1.1371925

Published Online: June 26, 2000

View Article titled, Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

Topics: Contact resistance, Copper, Cycles, Disks, Electrical conductance, Heating, Silicones, Sodium, Thermal conductivity, Thermal stability

Journal Articles

Effect of Wall Conduction on Natural Convection in an Enclosure With a Centered Heat Source

Yi-Hsiang Huang, Suresh K. Aggarwal

Publisher: ASME

J. Electron. Packag. December 1995, 117(4): 301–306.

https://doi.org/10.1115/1.2792109

Published Online: December 1, 1995

View Article titled, Effect of Wall Conduction on Natural Convection in an Enclosure With a Centered Heat Source

Topics: Heat, Heat conduction, Natural convection, Heat transfer, Thermal conductivity, Wall thickness, Rayleigh number, Algorithms, Boundary-value problems, Cavities

Journal Articles

Experimental Determination of Thermal Contact in a Diode-Heat Sink Assembly

V. K. Maudgal, J. Kliman, J. Miles, J. E. Sunderland

Publisher: ASME

J. Electron. Packag. December 1990, 112(4): 350–356.

https://doi.org/10.1115/1.2904389

Published Online: December 1, 1990

View Article titled, Experimental Determination of Thermal Contact in a Diode-Heat Sink Assembly

Topics: Heat, Manufacturing, Electrical conductance, Temperature, Aluminum foil, Pressure, Contact resistance, Geometry, Heat sinks, Steady state

Journal Articles

The Effect of Variations in Stream-Wise Spacing and Length on Convection From Surface Mounted Rectangular Components

G. L. Lehmann, R. A. Wirtz

Publisher: ASME

J. Electron. Packag. March 1989, 111(1): 26–32.

https://doi.org/10.1115/1.3226504

Published Online: March 1, 1989

View Article titled, The Effect of Variations in Stream-Wise Spacing and Length on Convection From Surface Mounted Rectangular Components

Topics: Convection, Reynolds number, Channel flow, Flow (Dynamics), Heat transfer, Cavities, Coolants, Dimensions, Electrical conductance, Flow visualization

Journal citation

NARROW

Optimization of a Thermoelectric Cooler for Time-Varying Heat Load and Sink Temperature

Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink

An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials

Lifetime Estimation of Moems Devices

Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material

Thermal Interfacing Techniques for Electronic Equipment—A Perspective

Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

Effect of Wall Conduction on Natural Convection in an Enclosure With a Centered Heat Source

Experimental Determination of Thermal Contact in a Diode-Heat Sink Assembly

The Effect of Variations in Stream-Wise Spacing and Length on Convection From Surface Mounted Rectangular Components

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