1-20 of 21
Elastic moduli
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core

Pratik Bansode, Rohit Suthar, Rabin Bhandari, Akshay Lakshminarayana, Naga Tejesh Eda, Gautam Gupta, Vibin Simon, Himanshu Modi, Vivek Nair, Pardeep Shahi, Satyam Saini, Krishna Bhavana Sivaraju, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041112.
Paper No: EP-24-1042
https://doi.org/10.1115/1.4066044
Published Online: August 9, 2024
View Article titled, Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core
Open the PDF for Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core in another window
Topics: Cooling, Elastic moduli, Fluids, Temperature, Thermomechanics, Heat, Energy dissipation, Glass transition, Data centers, Reliability
Journal Articles

Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031006.
Paper No: EP-22-1025
https://doi.org/10.1115/1.4064521
Published Online: March 11, 2024
View Article titled, Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging
Open the PDF for Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging in another window
Topics: Elastic moduli, Mechanical properties, Solders, Stress, Stress-strain curves, Temperature, Tensile strength, Testing, Viscoplasticity, Finite element analysis
Journal Articles

High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021108.
Paper No: EP-21-1060
https://doi.org/10.1115/1.4052073
Published Online: October 6, 2021
View Article titled, High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days
Open the PDF for High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days in another window
Topics: Elastic moduli, Mechanical properties, Solders, Stress, Stress-strain curves, Temperature, Tensile strength, Testing, Operating temperature, High temperature
Journal Articles

Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours

Pradeep Lall, Amrit Abrol, Nakul Kothari, Benjamin Leever, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041003.
Paper No: EP-20-1001
https://doi.org/10.1115/1.4048535
Published Online: October 12, 2020
View Article titled, Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours
Open the PDF for Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours in another window
Topics: Aerosols, Electrical resistivity, Failure, Inks, Shear (Mechanics), Sintering, Stress, Temperature, Elastic moduli, Printing
Journal Articles

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041104.
Paper No: EP-20-1003
https://doi.org/10.1115/1.4047392
Published Online: June 23, 2020
View Article titled, High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C
Open the PDF for High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C in another window
Topics: Elastic moduli, Mechanical properties, Stress, Temperature, Tensile strength, Storage, Solders
Journal Articles

Investigation of Elevated Temperature Mechanical Properties of Intermetallic Compounds in the Cu–Sn System Using Nanoindentation

Zuozhu Yin, Fenglian Sun, Mengjiao Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021004.
Paper No: EP-18-1042
https://doi.org/10.1115/1.4045980
Published Online: February 4, 2020
View Article titled, Investigation of Elevated Temperature Mechanical Properties of Intermetallic Compounds in the Cu–Sn System Using Nanoindentation
Open the PDF for Investigation of Elevated Temperature Mechanical Properties of Intermetallic Compounds in the Cu–Sn System Using Nanoindentation in another window
Topics: Elastic moduli, Intermetallic compounds, Temperature, Tin, Nanoindentation
Journal Articles

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model

Pavan Kumar Vaitheeswaran, Ganesh Subbarayan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020901.
Paper No: EP-17-1092
https://doi.org/10.1115/1.4039136
Published Online: May 9, 2018
View Article titled, Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model
Open the PDF for Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model in another window
Topics: Elastic moduli, Network models, Particulate matter, Stiffness, Fillers (Materials), Particle size, Mechanical properties
Journal Articles

Stress–Strain Behavior of SAC305 at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011010.
Paper No: EP-14-1001
https://doi.org/10.1115/1.4028641
Published Online: March 1, 2015
View Article titled, Stress–Strain Behavior of SAC305 at High Strain Rates
Open the PDF for Stress–Strain Behavior of SAC305 at High Strain Rates in another window
Topics: Deformation, Displacement, Failure, Finite element analysis, Finite element model, Lead-free solders, Manufacturing, Solders, Stress, Trusses (Building)
Journal Articles

Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation

Leila Ladani, Ousama Abdelhadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2015, 137(1): 014501.
Paper No: EP-13-1116
https://doi.org/10.1115/1.4027992
Published Online: October 6, 2014
View Article titled, Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation
Open the PDF for Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation in another window
Topics: Intermetallic compounds, Mechanical properties, Nanoindentation, Solder joints, Tin, Mechanical behavior, Size effect, Elastic moduli, Yield strength, Stress
Journal Articles

Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls

Wan Ho Song, Ali Karimi, Yan Huang, Michael Mayer, Norman Zhou, Jae Pil Jung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041007.
https://doi.org/10.1115/1.4000281
Published Online: October 29, 2009
View Article titled, Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls
Open the PDF for Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls in another window
Topics: Bonding, Displacement, Elastic moduli, Finite element analysis, Modeling, Sensitivity analysis, Simulation, Stress, Finite element model
Journal Articles

Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties

Mohd F. Abdulhamid, Cemal Basaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011002.
https://doi.org/10.1115/1.3068296
Published Online: February 11, 2009
View Article titled, Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties
Open the PDF for Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties in another window
Topics: Annealing, Lead-free solders, Mechanical properties, Solder joints, Solders, Temperature gradient, Tin, Testing, Elastic moduli, Nanoindentation
Journal Articles

Board Level Drop Test Analysis Based on Modal Test and Simulation

Fang Liu, Guang Meng, Mei Zhao, Junfeng Zhao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021007.
https://doi.org/10.1115/1.2912212
Published Online: May 8, 2008
View Article titled, Board Level Drop Test Analysis Based on Modal Test and Simulation
Open the PDF for Board Level Drop Test Analysis Based on Modal Test and Simulation in another window
Topics: Elastic moduli, Simulation, Printed circuit board assemblies, Damping, Design, Boundary-value problems
Journal Articles

Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging

Melida Chin, S. Jack Hu, James R. Barber
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021006.
https://doi.org/10.1115/1.2912180
Published Online: May 8, 2008
View Article titled, Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging
Open the PDF for Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging in another window
Topics: Adhesion, Adhesives, Anisotropy, Bonding, Contact resistance, Delamination, Design, Elastic moduli, Particulate matter, Resins
Journal Articles

Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation

Mithilesh Shah, Kaiyang Zeng, Andrew A. O. Tay
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 87–93.
https://doi.org/10.1115/1.1648062
Published Online: April 30, 2004
View Article titled, Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation
Open the PDF for Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation in another window
Topics: Heat, Nanoindentation, Recrystallization, Stress, Wire, Secondary ion mass spectrometry, Temperature, Bonding, Elastic moduli, Manganese (Metal)
Journal Articles

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, Member ASME, E. Suhir, Fellow ASME, G. W. Kammlott
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 260–267.
https://doi.org/10.1115/1.1349422
Published Online: January 11, 2000
View Article titled, Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach
Open the PDF for Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach in another window
Topics: Composite materials, Epoxy adhesives, Epoxy resins, Fillers (Materials), Molding, Particulate matter, Thermal expansion, Elastic moduli, Thermal stresses, Shear modulus
Journal Articles

Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications

N. R. Sottos, J. M. Ockers, M. Swindeman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 37–43.
https://doi.org/10.1115/1.2792659
Published Online: March 1, 1999
View Article titled, Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications
Open the PDF for Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications in another window
Topics: Composite materials, Printed circuit boards, Thermoelasticity, Textiles, Geometry, Lumber, Elastic moduli, Epoxy adhesives, Epoxy resins, Fibers
Journal Articles

Effect of Component Heterogeneity on Global CTE Mismatch Displacement in Areal-Array Solder Interconnects

S. M. Heinrich, S. Shakya, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 12–17.
https://doi.org/10.1115/1.2792278
Published Online: March 1, 1998
View Article titled, Effect of Component Heterogeneity on Global CTE Mismatch Displacement in Areal-Array Solder Interconnects
Open the PDF for Effect of Component Heterogeneity on Global CTE Mismatch Displacement in Areal-Array Solder Interconnects in another window
Topics: Displacement, Solders, Die cutting, Dimensions, Shearing (Deformation), Thermal energy, Elastic moduli, High temperature, Manufacturing, Relaxation (Physics)
Journal Articles

Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic

J. M. Hu, D. Barker, R. Ghoshtagore, M. Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 148–153.
https://doi.org/10.1115/1.2905503
Published Online: June 1, 1994
View Article titled, Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic
Open the PDF for Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic in another window
Topics: Ceramics, Low temperature, Thermomechanics, Temperature, Bending strength, Design, Elastic moduli, Electronic packages, Fracture toughness, Materials properties
Journal Articles

Temperature Dependence of the Mechanical Properties of GaAs Wafers

Jun Ming Hu, Michael Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 331–336.
https://doi.org/10.1115/1.2905416
Published Online: December 1, 1991
View Article titled, Temperature Dependence of the Mechanical Properties of GaAs Wafers
Open the PDF for Temperature Dependence of the Mechanical Properties of GaAs Wafers in another window
Topics: Gallium arsenide, Mechanical properties, Semiconductor wafers, Temperature effects, Materials properties, Temperature, Bending strength, Design, Elastic moduli, Elemental semiconductors
Journal Articles

Strains in Aluminum-Adhesive-Ceramic Trilayers

P. M. Hall, F. L. Howland, Y. S. Kim, L. H. Herring
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 288–302.
https://doi.org/10.1115/1.2904381
Published Online: December 1, 1990
View Article titled, Strains in Aluminum-Adhesive-Ceramic Trilayers
Open the PDF for Strains in Aluminum-Adhesive-Ceramic Trilayers in another window
Topics: Adhesives, Aluminum, Ceramics, Epoxy adhesives, Epoxy resins, Elastic moduli, Temperature, Dimensions, Elastomers, Heat