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Journal Articles

Hybrid Substrates for Heterogeneous Integration

John H. Lau, Gary Chang-Fu Chen, Channing Cheng-Lin Yang, Vincent Teng, Andy Yan-Jia Peng, Jones Yu-Cheng Huang, Hsing-Ning Liu, Y. H. Chen, Tzyy-Jang Tseng, Ming Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021001.
Paper No: EP-23-1025
https://doi.org/10.1115/1.4062993
Published Online: August 11, 2023
View Article titled, Hybrid Substrates for Heterogeneous Integration
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Topics: Bonding, Metals, Solder joints, Reliability, Dielectric materials
Journal Articles

A Heterogeneous Array of Off-Chip Interconnects for Optimum Mechanical and Electrical Performance

Karan Kacker, Thomas Sokol, Wansuk Yun, Madhavan Swaminathan, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 460–468.
https://doi.org/10.1115/1.2804096
Published Online: April 9, 2007
View Article titled, A Heterogeneous Array of Off-Chip Interconnects for Optimum Mechanical and Electrical Performance
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Topics: Automotive design, Manufacturing, Reliability, Dielectric materials, Stress, Thermomechanics, Semiconductor wafers, Finite element analysis, Fracture (Materials)
Journal Articles

Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling

Woon-Seong Kwon, Hyoung-Joon Kim, Kyung-Wook Paik, Se-Young Jang, Soon-Min Hong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 202–207.
https://doi.org/10.1115/1.1756143
Published Online: July 8, 2004
View Article titled, Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling
Open the PDF for Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling in another window
Topics: Adhesion, Aluminum, Cycles, Damage, Delamination, Dielectric materials, Displacement, Flip-chip packages, Fracture (Materials), Fracture (Process)
Journal Articles

Measurement of Thermal Deformation of Interconnect Layers Using SIEM

Sheng Chang and, Fu-Pen Chiang, Yifan Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 310–313.
https://doi.org/10.1115/1.1481367
Published Online: July 26, 2002
View Article titled, Measurement of Thermal Deformation of Interconnect Layers Using SIEM
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Topics: Deformation, Dielectric materials, Displacement, Electron microscopy, Interferometry, Packaging, Reliability, Resolution (Optics), Thermal deformation, Thermal expansion
Journal Articles

Warpage and Interfacial Stress Distribution in a Single-Level Integrated Module (SLIM)

R. C. Dunne, S. K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 197–203.
https://doi.org/10.1115/1.2792234
Published Online: September 1, 1997
View Article titled, Warpage and Interfacial Stress Distribution in a Single-Level Integrated Module (SLIM)
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Topics: Stress concentration, Warping, Thermomechanics, Delamination, Design, Dielectric materials, Electronic components, Failure, Shear (Mechanics), Stress
Journal Articles

Heat Conduction in Concentric Cylinders: An Application to Electronic Packages

Sanjeev Sathe
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 230–233.
https://doi.org/10.1115/1.2905690
Published Online: September 1, 1994
View Article titled, Heat Conduction in Concentric Cylinders: An Application to Electronic Packages
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Topics: Cylinders, Electronic packages, Heat conduction, Heat, Thermal conductivity, Aluminum, Copper, Dielectric materials, Dimensions, Electronic equipment