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Journal Articles

High-Performance Planar Thermal Diode With Wickless Components

George Damoulakis, Mohamad Jafari Gukeh, Theodore P. Koukoravas, Constantine M. Megaridis
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031004.
Paper No: EP-21-1020
https://doi.org/10.1115/1.4051467
Published Online: September 15, 2021
View Article titled, High-Performance Planar Thermal Diode With Wickless Components
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Topics: Heat, Vapors, Temperature, Thermal resistance, Heat transfer, Condensation, Copper
Journal Articles

Performance Study of a 980 nm GaAs Based Laser Diode Chip in a Moisture Condensing Environment

Sushma Madduri, Bahgat G. Sammakia, William Infantolino, Satish C. Chaparala, Lawrence C. Hughes, J. Micheal Harris
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011008.
https://doi.org/10.1115/1.4005910
Published Online: March 19, 2012
View Article titled, Performance Study of a 980 nm GaAs Based Laser Diode Chip in a Moisture Condensing Environment
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Topics: Condensation, Lasers, Temperature, Cycles
Journal Articles

Choosing Working Fluid for Two-Phase Thermosyphon Systems for Cooling of Electronics

Bjo¨rn Palm, Mem. ASME, Rahmatollah Khodabandeh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 276–281.
https://doi.org/10.1115/1.1571570
Published Online: June 10, 2003
View Article titled, Choosing Working Fluid for Two-Phase Thermosyphon Systems for Cooling of Electronics
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Topics: Boiling, Cooling, Fluids, Pressure drop, Heat transfer, Temperature, Heat, Condensation
Journal Articles

Alternative Curing Methods for FCOB Underfill

M. M. Merton, C. P. Malhotra, N. Nikmanesh, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 249–254.
https://doi.org/10.1115/1.2793848
Published Online: December 1, 1999
View Article titled, Alternative Curing Methods for FCOB Underfill
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Topics: Hardening (Curing), Condensation, Failure mechanisms, Heat transfer, Vapors, Delamination, Failure, Fatigue failure, Flip-chip, Heating
Journal Articles

Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization

K. J. Zwick, I. M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 215–219.
https://doi.org/10.1115/1.2792094
Published Online: September 1, 1995
View Article titled, Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization
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Topics: Flow visualization, Hardening (Curing), Jets, Ovens, Vapors, Vortices, Condensation, Contamination, Flow (Dynamics), Bonding
Journal Articles

Transient Response Characteristics of Vapor Deposited Micro Heat Pipe Arrays

G. P. Peterson, A. K. Mallik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1995, 117(1): 82–87.
https://doi.org/10.1115/1.2792072
Published Online: March 1, 1995
View Article titled, Transient Response Characteristics of Vapor Deposited Micro Heat Pipe Arrays
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Topics: Heat pipes, Transients (Dynamics), Vapors, Semiconductor wafers, Computer simulation, Condensation, Imaging, Semiconductor device reliability, Temperature, Temperature gradient