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1-20 of 19123
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021004.
Paper No: EP-22-1038
Published Online: August 18, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021003.
Paper No: EP-22-1036
Published Online: August 18, 2022
Image
in Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
> Journal of Electronic Packaging
Published Online: August 18, 2022
Fig. 1 Freestanding outdoor digital display with a Comms Cap [ 4 ] More
Image
in Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
> Journal of Electronic Packaging
Published Online: August 18, 2022
Fig. 2 Interior view with enclosure doors opened of sample configuration of devices within a Comms Cap More
Image
in Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
> Journal of Electronic Packaging
Published Online: August 18, 2022
Fig. 3 Brief description of historical development, power density trends, and relative range for wireless network generations [ 5 ]: ( a ) historical development and increasing power density trends for wireless network generations and ( b ) relative cellular network range for macro and small cellu... More
Image
in Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
> Journal of Electronic Packaging
Published Online: August 18, 2022
Fig. 4 Solar angle geometry More
Image
in Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
> Journal of Electronic Packaging
Published Online: August 18, 2022
Fig. 5 Design day transient boundary conditions.( a )–( e ) are design day solar irradiance for ECT climate models and case study locations, and ( f ) is design day diurnal temperature profiles for all case studies: ( a ) solar loading for the ECT climate model, ( b ) solar loading near New York, ... More
Image
in Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
> Journal of Electronic Packaging
Published Online: August 18, 2022
Fig. 5 Design day transient boundary conditions.( a )–( e ) are design day solar irradiance for ECT climate models and case study locations, and ( f ) is design day diurnal temperature profiles for all case studies: ( a ) solar loading for the ECT climate model, ( b ) solar loading near New York, ... More
Image
in Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
> Journal of Electronic Packaging
Published Online: August 18, 2022
Fig. 6 Fluid domain and boundary conditions More
Image
in Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
> Journal of Electronic Packaging
Published Online: August 18, 2022
Fig. 7 Fully assembled and instrumented representative small cell device More
Image
in Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
> Journal of Electronic Packaging
Published Online: August 18, 2022
Fig. 8 Numerical simulation independence study analyses: ( a ) mesh independence analysis and ( b ) time step independence analysis More
Image
in Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
> Journal of Electronic Packaging
Published Online: August 18, 2022
Fig. 9 Experimental setup of Comms Cap: ( a ) fully assembled Comms Cap ready to be deployed and ( b ) relative location of devices in deployed Comms Cap More
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in Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
> Journal of Electronic Packaging
Published Online: August 18, 2022
Fig. 10 Rendering of thermocouple locations on Comms Cap More
Image
in Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
> Journal of Electronic Packaging
Published Online: August 18, 2022
Fig. 11 Local ambient conditions used for simulation validation for two case study days: ( a ) case study: April 6, 2021 and ( b ) case study: May 1, 2021 More
Image
in Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
> Journal of Electronic Packaging
Published Online: August 18, 2022
Fig. 12 Validation of case study simulations with experimental uncertainty illustrated by shaded bands for two case study days: ( a ) validation case study 1: April 6, 2021 and ( b ) validation case study 2: May 1, 2021 More
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in Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
> Journal of Electronic Packaging
Published Online: August 18, 2022
Fig. 13 Validation of outlet air temperatures for Comms Cap during validation case 2: May 1, 2021: ( a ) Comms Cap outlet air temperatures and ( b ) temperature rise through Comms Cap More
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in Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
> Journal of Electronic Packaging
Published Online: August 18, 2022
Fig. 14 Temperature results for case studies: ( a ) ECT climate model, ( b ) New York, NY in the summer, ( c )Miami, FL, ( d ) Phoenix, AZ, and ( e ) New York, NY in the winter More
Image
in Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
> Journal of Electronic Packaging
Published Online: August 18, 2022
Fig. 14 Temperature results for case studies: ( a ) ECT climate model, ( b ) New York, NY in the summer, ( c )Miami, FL, ( d ) Phoenix, AZ, and ( e ) New York, NY in the winter More
Image
in Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
> Journal of Electronic Packaging
Published Online: August 18, 2022
Fig. 15 Outlet air temperatures for Comms Cap: ( a ) Comms Cap outlet air temperatures and ( b ) temperature rise through Comms Cap More
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in An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging
> Journal of Electronic Packaging
Published Online: August 18, 2022
Fig. 1 Multiregion analysis models: ( a ) fully coupled problem and ( b ) partially coupled problem More