Volume 114 Issue 4 | J. Electron. Packag.

Topics: Circuits , Modeling , Vibration analysis , Reliability , Mode shapes , Copper , Dynamic response , Electronic packages , Electronics , Epoxy adhesives

Microelectronics and the Built-Up-Bar Theory

B. Mirman

J. Electron. Packag. December 1992, 114(4): 384–388. doi: https://doi.org/10.1115/1.2905469

Abstract

View articletitled, Microelectronics and the Built-Up-Bar Theory

Open the PDF for in another window

Topics: Microelectronic devices , Stress

Interlaminar Stresses in Layered Beams

B. Mirman

J. Electron. Packag. December 1992, 114(4): 389–396. doi: https://doi.org/10.1115/1.2905470

Abstract

View articletitled, Interlaminar Stresses in Layered Beams

Open the PDF for in another window

Topics: Stress , Shear (Mechanics)

Modeling Thermal Stresses in Periodic Structures: Some Observations Regarding the Boundary Conditions

A. O. Cifuentes, S. R. Stiffler

J. Electron. Packag. December 1992, 114(4): 397–402. doi: https://doi.org/10.1115/1.2905471

Abstract

View articletitled, Modeling Thermal Stresses in Periodic Structures: Some Observations Regarding the Boundary Conditions

Open the PDF for in another window

Topics: Boundary-value problems , Modeling , Periodic structures , Thermal stresses , Electronics

The Distribution of the Stress Intensity Factor Along the Front of the Growing Crack in an Optical Glass Fiber

M. Muraoka, H. Abe´, N. Aizawa

J. Electron. Packag. December 1992, 114(4): 403–406. doi: https://doi.org/10.1115/1.2905472

Abstract

View articletitled, The Distribution of the Stress Intensity Factor Along the Front of the Growing Crack in an Optical Glass Fiber

Open the PDF for in another window

Topics: Fibers , Fracture (Materials) , Optical glass , Stress , Boundary element methods , Geometry , Optical fiber

A New Method for Measuring Adhesion Strength of IC Molding Compounds

Asao Nishimura, Isao Hirose, Naotaka Tanaka

J. Electron. Packag. December 1992, 114(4): 407–412. doi: https://doi.org/10.1115/1.2905473

Abstract

View articletitled, A New Method for Measuring Adhesion Strength of IC Molding Compounds

Open the PDF for in another window

Topics: Adhesion , Molding , Stress , Alloys , Design , Dimensions , Evaluation methods , Fracture (Materials) , Stress analysis (Engineering) , Structural design

PCB Trace Thermal Analysis and Effective Conductivity

T. F. Lemczyk, B. L. Mack, J. R. Culham, M. M. Yovanovich

J. Electron. Packag. December 1992, 114(4): 413–419. doi: https://doi.org/10.1115/1.2905474

Abstract

View articletitled, PCB Trace Thermal Analysis and Effective Conductivity

Open the PDF for in another window

Topics: Thermal analysis , Thermal conductivity , Heat , Printed circuit boards , Electric current , Glass reinforced plastics , Heat conduction , Microelectronic devices , Operating temperature , Steady state

Effects of Channel Height and Planar Spacing on Air Cooling of Electronic Components

David Copeland

J. Electron. Packag. December 1992, 114(4): 420–424. doi: https://doi.org/10.1115/1.2905475

Abstract

View articletitled, Effects of Channel Height and Planar Spacing on Air Cooling of Electronic Components

Open the PDF for in another window

Topics: Cooling , Electronic components , Temperature , Aluminum , Ceramics , Forced convection , Heat transfer coefficients , Heating , Reynolds number , Shapes

Two-Level Nonlinear Mixed Discrete-Continuous Optimization-Based Design: An Application to Printed Circuit Board Assemblies

S. Praharaj, S. Azarm

J. Electron. Packag. December 1992, 114(4): 425–435. doi: https://doi.org/10.1115/1.2905476

Abstract

View articletitled, Two-Level Nonlinear Mixed Discrete-Continuous Optimization-Based Design: An Application to Printed Circuit Board Assemblies

Open the PDF for in another window

Topics: Design , Optimization , Printed circuit board assemblies , Algorithms , Flow (Dynamics) , Lumber , Manufacturing , Printed circuit boards , Reliability

On the Use of Micro Heat Pipes as an Integral Part of Semiconductor Devices

A. K. Mallik, G. P. Peterson, M. H. Weichold

J. Electron. Packag. December 1992, 114(4): 436–442. doi: https://doi.org/10.1115/1.2905477

Abstract

View articletitled, On the Use of Micro Heat Pipes as an Integral Part of Semiconductor Devices

Open the PDF for in another window

Topics: Heat pipes , Semiconductor devices , Computer simulation , Heat , Temperature , Temperature gradient , Density , Flat heat pipes , Flux (Metallurgy) , Heat flux

Low Temperature Transient Liquid Phase (LTTLP) Bonding for Au/Cu and Cu/Cu Interconnections

M. M. Hou, Thomas W. Eagar

J. Electron. Packag. December 1992, 114(4): 443–447. doi: https://doi.org/10.1115/1.2905478

Abstract

View articletitled, Low Temperature Transient Liquid Phase (LTTLP) Bonding for Au/Cu and Cu/Cu Interconnections

Open the PDF for in another window

Topics: Bonding , Low temperature , Transients (Dynamics) , Temperature , Tin , Copper , Fatigue , Solders , Aluminum , Diffusion bonding (Metals)

Time-Dependent Ductility of Electro-Deposited Copper

Yoshiki Oshida, P. C. Chen, J. D. Reid, T. Nishihara

J. Electron. Packag. December 1992, 114(4): 448–454. doi: https://doi.org/10.1115/1.2905479

Abstract

View articletitled, Time-Dependent Ductility of Electro-Deposited Copper

Open the PDF for in another window

Topics: Copper , Ductility , Temperature , Annealing , Current density , Dislocation density , Electrodes , Electrons , Film thickness , Grain size

Application of Linear Assignment Model for Planning of Robotic Printed Circuit Board Assembly

Z. Ji, M. C. Leu, H. Wong

J. Electron. Packag. December 1992, 114(4): 455–460. doi: https://doi.org/10.1115/1.2905480

Abstract

View articletitled, Application of Linear Assignment Model for Planning of Robotic Printed Circuit Board Assembly

Open the PDF for in another window

Topics: Printed circuit board assemblies , Robotics , Manufacturing , Printed circuit boards

A Shape Optimal Design Methodology for Packaging Design

S. D. Rajan, Ben Nagaraj, Mali Mahalingam

J. Electron. Packag. December 1992, 114(4): 461–466. doi: https://doi.org/10.1115/1.2905481

Abstract

View articletitled, A Shape Optimal Design Methodology for Packaging Design

Open the PDF for in another window

Topics: Design , Design methodology , Packaging , Shapes , Nonlinear programming , Aerospace industry , Electronic packaging , Finite element analysis

Technical Briefs

Predicted Residual Bow of Thin Plastic Packages of Integrated Circuit Devices

E. Suhir

J. Electron. Packag. December 1992, 114(4): 467–470. doi: https://doi.org/10.1115/1.2905482

Abstract

View articletitled, Predicted Residual Bow of Thin Plastic Packages of Integrated Circuit Devices

Open the PDF for in another window

Topics: Computational methods , Design , Epoxy adhesives , Epoxy resins , Finite element analysis , Integrated circuits , Manufacturing , Metals , Printed circuit boards , Silicon

A Note on the Implementation of Temperature Dependent Coefficient of Thermal Expansion (CTE) in ABAQUS

Yi-Hsin Pao, Edward Jih, Bruce E. Artz, Larry W. Cathey

J. Electron. Packag. December 1992, 114(4): 470–472. doi: https://doi.org/10.1115/1.2905483

Abstract

View articletitled, A Note on the Implementation of Temperature Dependent Coefficient of Thermal Expansion (CTE) in ABAQUS

Open the PDF for in another window

Topics: Temperature , Thermal expansion , Errors , Electronic packages , Engineers , Error analysis , Finite element analysis , Finite element model , Modeling , Temperature effects

Predicting Thermal Fatigue Lifetimes for SMT Solder Joints

J. Sauber, J. Seyyedi

J. Electron. Packag. December 1992, 114(4): 472–476. doi: https://doi.org/10.1115/1.2905484

Abstract

View articletitled, Predicting Thermal Fatigue Lifetimes for SMT Solder Joints

Open the PDF for in another window

Topics: Fatigue , Solder joints , Creep , Finite element model , Stress , Temperature

Quantitative Solder Wetting Measurement for DCA Assembly

Cynthia M. Melton, Carl J. Raleigh, Susan M. Yarling

J. Electron. Packag. December 1992, 114(4): 476–479. doi: https://doi.org/10.1115/1.2905485

Abstract

View articletitled, Quantitative Solder Wetting Measurement for DCA Assembly

Open the PDF for in another window

Topics: Manufacturing , Solders , Wetting , Alloys , Experimental design , Nitrogen

Book Reviews

Handbook of Tape Automated Bonding

John H. Lau, Editor, William T. Chen, Reviewer

J. Electron. Packag. December 1992, 114(4): 480. doi: https://doi.org/10.1115/1.2905486

View articletitled, <em>Handbook of Tape Automated Bonding</em>

Open the PDF for in another window

Topics: Bonding

Research Papers

Nonlinear Dynamic Response of a Printed Circuit Board to Shock Loads Applied to Its Support Contour

Comparison of Modeling Techniques for the Vibration Analysis of Printed Circuit Cards

Microelectronics and the Built-Up-Bar Theory

Interlaminar Stresses in Layered Beams

Modeling Thermal Stresses in Periodic Structures: Some Observations Regarding the Boundary Conditions

The Distribution of the Stress Intensity Factor Along the Front of the Growing Crack in an Optical Glass Fiber

A New Method for Measuring Adhesion Strength of IC Molding Compounds

PCB Trace Thermal Analysis and Effective Conductivity

Effects of Channel Height and Planar Spacing on Air Cooling of Electronic Components

Two-Level Nonlinear Mixed Discrete-Continuous Optimization-Based Design: An Application to Printed Circuit Board Assemblies

On the Use of Micro Heat Pipes as an Integral Part of Semiconductor Devices

Low Temperature Transient Liquid Phase (LTTLP) Bonding for Au/Cu and Cu/Cu Interconnections

Time-Dependent Ductility of Electro-Deposited Copper

Application of Linear Assignment Model for Planning of Robotic Printed Circuit Board Assembly

A Shape Optimal Design Methodology for Packaging Design

Technical Briefs

Predicted Residual Bow of Thin Plastic Packages of Integrated Circuit Devices

A Note on the Implementation of Temperature Dependent Coefficient of Thermal Expansion (CTE) in ABAQUS

Predicting Thermal Fatigue Lifetimes for SMT Solder Joints

Quantitative Solder Wetting Measurement for DCA Assembly

Book Reviews

Handbook of Tape Automated Bonding

Email alerts

RSS Feeds

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

Issues

Research Papers

Technical Briefs

Book Reviews

Email alerts

RSS Feeds

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only