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Issues
June 2023
In Progress
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia
J. Electron. Packag. June 2023, 145(2): 021001.
doi: https://doi.org/10.1115/1.4054972
Topics:
Computers
,
Cooling
,
Copper
,
Corrosion
,
Nickel plating
,
Plates (structures)
,
Pressure drop
,
Temperature
,
Thermal resistance
,
Flow (Dynamics)
Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions
J. Electron. Packag. June 2023, 145(2): 021002.
doi: https://doi.org/10.1115/1.4055024
Topics:
Electrodiffusion
,
Failure
,
Solder joints
,
Solders
,
Stress
,
Temperature
,
Tension
,
Testing
,
Current density
,
Tin
An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging
J. Electron. Packag. June 2023, 145(2): 021003.
doi: https://doi.org/10.1115/1.4055125
Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
J. Electron. Packag. June 2023, 145(2): 021004.
doi: https://doi.org/10.1115/1.4055094
Topics:
Climate
,
Design
,
Solar energy
,
Temperature
,
Thermal management
,
Transients (Dynamics)
,
Solar radiation
,
Smart cities
,
Computer simulation
,
Cycles
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Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions
J. Electron. Packag (June 2023)
Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks
J. Electron. Packag (March 2023)
