Fatigue failure of solder joints is one of the major causes of failure in electronic devices. Fatigue life prediction models of solder joints were first put forward in the early 1960s, and since then, numbers of methods were used to model the fatigue mechanism of solder joints. In this article, the majority fatigue life models are summarized, with emphasis on the latest developments in the fatigue life prediction methods. All the models reviewed are grouped into four categories based on the factors affecting the fatigue life of solder joints, which are: plastic strain-based fatigue models, creep damage-based fatigue models, energy-based fatigue models, and damage accumulation-based fatigue models. The models that do not fit any of the above categories are grouped into “other models.” Applications and potential limitations for those models are also discussed.
Skip Nav Destination
Article navigation
December 2019
Review Articles
A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint
Sinan Su,
Sinan Su
Department of Industrial and
Systems Engineering,
Auburn University,
3301 Shelby Center,
Auburn, AL 36849
Systems Engineering,
Auburn University,
3301 Shelby Center,
Auburn, AL 36849
Search for other works by this author on:
Francy John Akkara,
Francy John Akkara
Department of Industrial and
Systems Engineering,
Auburn University,
Auburn, AL 36849
Systems Engineering,
Auburn University,
3301 Shelby Center
,Auburn, AL 36849
Search for other works by this author on:
Ravinder Thaper,
Ravinder Thaper
Department of Industrial and
Systems Engineering,
Auburn University,
Auburn, AL 36849
Systems Engineering,
Auburn University,
3301 Shelby Center
,Auburn, AL 36849
Search for other works by this author on:
Atif Alkhazali,
Atif Alkhazali
Department of Industrial Engineering,
The Hashemite University,
Az-Zarqa 13133, Jordan
The Hashemite University,
Az-Zarqa 13133, Jordan
Search for other works by this author on:
Mohammad Hamasha,
Mohammad Hamasha
Department of Industrial Engineering,
The Hashemite University,
Az-Zarqa 13133, Jordan
The Hashemite University,
Az-Zarqa 13133, Jordan
Search for other works by this author on:
Sa'd Hamasha
Sa'd Hamasha
Department of Industrial and
Systems Engineering,
Auburn University,
Auburn, AL 36849
e-mail: smh0083@auburn.edu
Systems Engineering,
Auburn University,
3301 Shelby Center
,Auburn, AL 36849
e-mail: smh0083@auburn.edu
1Corresponding author.
Search for other works by this author on:
Sinan Su
Department of Industrial and
Systems Engineering,
Auburn University,
3301 Shelby Center,
Auburn, AL 36849
Systems Engineering,
Auburn University,
3301 Shelby Center,
Auburn, AL 36849
Francy John Akkara
Department of Industrial and
Systems Engineering,
Auburn University,
Auburn, AL 36849
Systems Engineering,
Auburn University,
3301 Shelby Center
,Auburn, AL 36849
Ravinder Thaper
Department of Industrial and
Systems Engineering,
Auburn University,
Auburn, AL 36849
Systems Engineering,
Auburn University,
3301 Shelby Center
,Auburn, AL 36849
Atif Alkhazali
Department of Industrial Engineering,
The Hashemite University,
Az-Zarqa 13133, Jordan
The Hashemite University,
Az-Zarqa 13133, Jordan
Mohammad Hamasha
Department of Industrial Engineering,
The Hashemite University,
Az-Zarqa 13133, Jordan
The Hashemite University,
Az-Zarqa 13133, Jordan
Sa'd Hamasha
Department of Industrial and
Systems Engineering,
Auburn University,
Auburn, AL 36849
e-mail: smh0083@auburn.edu
Systems Engineering,
Auburn University,
3301 Shelby Center
,Auburn, AL 36849
e-mail: smh0083@auburn.edu
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received December 18, 2018; final manuscript received March 27, 2019; published online May 17, 2019. Assoc. Editor: Tse Eric Wong.
J. Electron. Packag. Dec 2019, 141(4): 040802 (13 pages)
Published Online: May 17, 2019
Article history
Received:
December 18, 2018
Revised:
March 27, 2019
Citation
Su, S., Akkara, F. J., Thaper, R., Alkhazali, A., Hamasha, M., and Hamasha, S. (May 17, 2019). "A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint." ASME. J. Electron. Packag. December 2019; 141(4): 040802. https://doi.org/10.1115/1.4043405
Download citation file:
Get Email Alerts
Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag (December 2024)
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Related Articles
Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint
J. Electron. Packag (March,2021)
A Damage-Mechanics-Based Constitutive Model for Solder Joints
J. Electron. Packag (September,2005)
A Review of Recent Research on the Mechanical Behavior of Lead-Free Solders
Appl. Mech. Rev (July,2017)
A Nonlinear Multi-Domain Stress Analysis Method for Surface-Mount Solder Joints
J. Electron. Packag (June,1996)
Related Proceedings Papers
Related Chapters
Understanding the Problem
Design and Application of the Worm Gear
Division 5—High Temperature Reactors
Companion Guide to the ASME Boiler and Pressure Vessel Codes, Volume 1, Fifth Edition
Division 5—High Temperature Reactors
Online Companion Guide to the ASME Boiler & Pressure Vessel Codes