The revolutionary changes in automotive industry toward fully connected automated electrical vehicles necessitate developments in automotive electronics at unprecedented speed. Signal, control, and power electronics will heterogeneously be integrated at minimum space with sensors and actuators to form highly compact and ultra-smart systems for functions like traction, lighting, energy management, computation, and communication. Most of these systems will be highly safety relevant with the requirements in system availability exceeding today's already high automotive standards. Unlike the human drivers of today, passengers in the automated car do not pay constant attention to the driving actions of the vehicle. Hence, reliability research is massively challenged by the new automotive applications. Guaranteeing the specified lifetime at statistical average is no longer sufficient. Assuring that no failure of an individual safety relevant part occurs unexpectedly becomes most important. The paper surveys the priority actions underway to cope with the tremendous challenges. It highlights practical examples in all three directions of reliability research: (i) Experimental reliability tests and physical analyses: New and highly efficient accelerated stress tests are able to cover the complex and multifold loading situation in the field. New analytics techniques can identify the typical failure modes and their physical root causes; (ii) Virtual techniques: Schemes of validated simulations allow capturing the physics of failure (PoF) proactively in the design for reliability (DfR) process; and (iii) Prognostics health management (PHM). A new concept is introduced for adding a minimum of PHM features at various levels of automotive electronics to provide functional safety as required for autonomous vehicles. This way, the new generation of reliability methods will continuously provide estimates of the remaining useful life (RUL) for each relevant part under the actual use conditions to allow triggering maintenance in time
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March 2018
Research-Article
Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches
Sven Rzepka,
Sven Rzepka
Micro Materials Center,
Fraunhofer Institute for Electronic Nano
Systems (ENAS),
Chemnitz D-09126, Germany
e-mail: sven.rzepka@enas.fraunhofer.de
Fraunhofer Institute for Electronic Nano
Systems (ENAS),
Chemnitz D-09126, Germany
e-mail: sven.rzepka@enas.fraunhofer.de
Search for other works by this author on:
Alexander Otto,
Alexander Otto
Micro Materials Center,
Fraunhofer Institute for Electronic Nano
Systems (ENAS),
Chemnitz D-09126, Germany
Fraunhofer Institute for Electronic Nano
Systems (ENAS),
Chemnitz D-09126, Germany
Search for other works by this author on:
Dietmar Vogel,
Dietmar Vogel
Micro Materials Center,
Fraunhofer Institute for Electronic Nano
Systems (ENAS),
Chemnitz D-09126, Germany
Fraunhofer Institute for Electronic Nano
Systems (ENAS),
Chemnitz D-09126, Germany
Search for other works by this author on:
Rainer Dudek
Rainer Dudek
Micro Materials Center,
Fraunhofer Institute for Electronic Nano
Systems (ENAS),
Chemnitz D-09126, Germany
Fraunhofer Institute for Electronic Nano
Systems (ENAS),
Chemnitz D-09126, Germany
Search for other works by this author on:
Sven Rzepka
Micro Materials Center,
Fraunhofer Institute for Electronic Nano
Systems (ENAS),
Chemnitz D-09126, Germany
e-mail: sven.rzepka@enas.fraunhofer.de
Fraunhofer Institute for Electronic Nano
Systems (ENAS),
Chemnitz D-09126, Germany
e-mail: sven.rzepka@enas.fraunhofer.de
Alexander Otto
Micro Materials Center,
Fraunhofer Institute for Electronic Nano
Systems (ENAS),
Chemnitz D-09126, Germany
Fraunhofer Institute for Electronic Nano
Systems (ENAS),
Chemnitz D-09126, Germany
Dietmar Vogel
Micro Materials Center,
Fraunhofer Institute for Electronic Nano
Systems (ENAS),
Chemnitz D-09126, Germany
Fraunhofer Institute for Electronic Nano
Systems (ENAS),
Chemnitz D-09126, Germany
Rainer Dudek
Micro Materials Center,
Fraunhofer Institute for Electronic Nano
Systems (ENAS),
Chemnitz D-09126, Germany
Fraunhofer Institute for Electronic Nano
Systems (ENAS),
Chemnitz D-09126, Germany
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received September 20, 2017; final manuscript received January 8, 2018; published online March 2, 2018. Assoc. Editor: Ercan Dede.
J. Electron. Packag. Mar 2018, 140(1): 010903 (12 pages)
Published Online: March 2, 2018
Article history
Received:
September 20, 2017
Revised:
January 8, 2018
Citation
Rzepka, S., Otto, A., Vogel, D., and Dudek, R. (March 2, 2018). "Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches." ASME. J. Electron. Packag. March 2018; 140(1): 010903. https://doi.org/10.1115/1.4039333
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