Overhang and/or pyramid stacked packages are the trend in the semiconductor industry. As the stacked layers increase drastically, the wire sweep and wire sag problems become more and more serious. Based on some types of frequently used stacked configurations, their corresponding wire sweep and wire sag stiffness and deflections are investigated for extra-high stacked layers. Two typical profiles of Q_loop and S_loop wire bonds are included in this study. However, wire sweep and wire sag have to be considered in two different design aspects. For wire sweep, we have the conclusion that the maximum wire sweep deflections always occur near the central segment of a wire bond. As for the wire sag, the maximum wire sag may take place in the center region of the straight portion of a wire bond. The result shows that the deflections of wire sag can be reduced significantly by simply shifting the position of the kink or bend created within a wire bond. Finally, we have concluded that a stacked configuration with smallest bond span may be the preferred selection for the concerns of wire sweep and wire sag issues.
Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received April 13, 2017; final manuscript received July 8, 2017; published online July 27, 2017. Assoc. Editor: Yi-Shao Lai.
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Kung, H., and Hsieh, C. (July 27, 2017). "Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages." ASME. J. Electron. Packag. December 2017; 139(4): 041002. https://doi.org/10.1115/1.4037276
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