In this paper, soldering experiments of fine pitch quad flat package (QFP) devices were carried out when soldered with Sn–Ag–Cu and Sn–Cu–Ni lead-free solders by means of diode laser soldering system, and compared with the experimental results soldered with Sn–Pb solders and with infrared (IR) reflow soldering method. The results indicate that under the conditions of laser continuous scanning mode and the fixed laser soldering time, an optimal power is obtained when the optimal mechanical properties of QFP microjoints are achieved. Mechanical properties of QFP microjoints soldered with laser soldering system are better than that of QFP microjoints soldered with IR soldering method. Results also indicate that adding rare earth element Ce to Sn–Ag–Cu and Sn–Cu–Ni lead-free solders improves mechanical properties of QFP microjoints, and the optimal amount of Ce is about 0.03%.
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June 2009
Research Papers
Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders
Zongjie Han,
Zongjie Han
College of Materials Science and Technology,
Nanjing University of Aeronautics and Astronautics
, 210016 Nanjing, P. R. C.
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Songbai Xue,
Songbai Xue
College of Materials Science and Technology,
Nanjing University of Aeronautics and Astronautics
, 210016 Nanjing, P. R. C.
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Jianxin Wang,
Jianxin Wang
College of Materials Science and Technology,
Nanjing University of Aeronautics and Astronautics
, 210016 Nanjing, P. R. C.
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Xin Zhang,
Xin Zhang
College of Materials Science and Technology,
Nanjing University of Aeronautics and Astronautics
, 210016 Nanjing, P. R. C.
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Shenglin Yu,
Shenglin Yu
College of Materials Science and Technology,
Nanjing University of Aeronautics and Astronautics
, 210016 Nanjing, People’s Republic of China; The 14th Research Institute, China Electronics Technology Group Corporation
, 210013 Nanjing, P. R. C.
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Liang Zhang
Liang Zhang
College of Materials Science and Technology,
Nanjing University of Aeronautics and Astronautics
, 210016 Nanjing, P. R. C.
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Zongjie Han
College of Materials Science and Technology,
Nanjing University of Aeronautics and Astronautics
, 210016 Nanjing, P. R. C.
Songbai Xue
College of Materials Science and Technology,
Nanjing University of Aeronautics and Astronautics
, 210016 Nanjing, P. R. C.
Jianxin Wang
College of Materials Science and Technology,
Nanjing University of Aeronautics and Astronautics
, 210016 Nanjing, P. R. C.
Xin Zhang
College of Materials Science and Technology,
Nanjing University of Aeronautics and Astronautics
, 210016 Nanjing, P. R. C.
Shenglin Yu
College of Materials Science and Technology,
Nanjing University of Aeronautics and Astronautics
, 210016 Nanjing, People’s Republic of China; The 14th Research Institute, China Electronics Technology Group Corporation
, 210013 Nanjing, P. R. C.
Liang Zhang
College of Materials Science and Technology,
Nanjing University of Aeronautics and Astronautics
, 210016 Nanjing, P. R. C.J. Electron. Packag. Jun 2009, 131(2): 021004 (5 pages)
Published Online: April 1, 2009
Article history
Received:
November 20, 2007
Revised:
November 13, 2008
Published:
April 1, 2009
Citation
Han, Z., Xue, S., Wang, J., Zhang, X., Yu, S., and Zhang, L. (April 1, 2009). "Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders." ASME. J. Electron. Packag. June 2009; 131(2): 021004. https://doi.org/10.1115/1.3103932
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