Thermal residual plastic deformation of bond joints on thin film based DWDM module under thermal cycles loading was investigated using three-dimensional finite element analysis. Finite element simulations were carried out to investigate the effect of the 4 and 6 solder-joint designs for the metal tube with 0.1 mm alignment offset. It was found that 6-solder joint requires more thermal cycles to arrive a stable tilt angle. The transverse movement of metal tube under thermal loading was also examined to determine the influence of solder volume imperfections and solder materials. Favorable results were obtained for 80Au20Sn solder as compared to 63Sn37Pb solder. From the thermal-elasto-plastic analysis, the solder volume control has great impact on the metal tube movement and tilt angle during thermal loadings. If adequate solder volume is provided in four solder joints, the minimum alignment shift of the metal tube is projected to be comparable to an optimally designed bond joint geometry.

Issue Section:
Research Paper
Keywords:
gold alloys, electronics packaging, tin alloys, wavelength division multiplexing, optical communication equipment, finite element analysis, solders, plastic deformation, elastoplasticity
Topics:
Solders, Metals, Manufacturing, Thin films, Deformation
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