Thermal reliability of the solder sealing ring of Agilent Technologies’ bubble-actuated photonic cross-connect switches has been investigated in this paper. Emphasis is placed on the determination of the thermal-fatigue life of the solder sealing ring under shipping/storing/handling conditions. The solder ring is assumed to obey the Garofalo-Arrhenius creep constitutive law. The nonlinear responses such as the deflections, stresses, creep strains, and creep strain energy density of the 3-D photonic package have been determined with a commercial finite element code. In addition, isothermal fatigue tests have been performed to obtain the relationship between the number of cycle-to-failure and the strain energy density. Thus, by combining the finite element results and the isothermal fatigue test results, the average thermal-fatigue life of the solder sealing ring is readily determined and is found to be more than adequate for shipping/storing/handling the photonic switches.
Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD Division, 2001; revised manuscript received August 6, 2002. Associate Editor: E. Suhir.
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Lau, J., Mei , Z., Pang , S., Amsden , C., Rayner , J., and Pan , S. (December 12, 2002). "Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch ." ASME. J. Electron. Packag. December 2002; 124(4): 403–410. https://doi.org/10.1115/1.1512294
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